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JM38510/32901BCA

Texas Instruments

JM38510/32901BCA by Texas Instruments

JM38510/32901BCA by Texas Instruments is a 9-bit digital arithmetic circuit with 50ns propagation delay at 5V. MIL-M-38510 Class B screening level, TTL technology, and -55 to 125°C operating temperature range make it ideal for military applications. Package style is in-line with 14 terminals and ceramic, glass-sealed body material.

Median Price

$22.365

Lifecycle Status

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25

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1k+

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Rochester

USA . 77 parts In-Stock

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$19.880

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$17.790

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$16.740

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DigiKey

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Verical

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$20.925

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Avnet

USA . 24 parts In-Stock

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$15.855

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Freelance Electronics

USA . 458 parts In-Stock

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TEDSS.com

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Digiode

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Electronic Expediters

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Vyrian

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Classic Components Corporation

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Mil-Aero Solutions, Inc.

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Resion

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ACDS - Activité Composants Distribution Service

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First Choice Components Inc.

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Electronics Depot

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Atlantic Semiconductor

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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QIE Inc.

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Ampacity Inc.

Singapore . 31 parts In-Stock

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$16.330

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Corphita

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Andel Nordic

Denmark . 383 parts In-Stock

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Parana Technologies

USA . 1,361 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,165 parts In-Stock

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IDEA Electronic Components Group

UK . 140 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Overview

Elevate your digital arithmetic circuits with the JM38510/32901BCA from Texas Instruments, a leading manufacturer known for top-notch quality and reliability. Ideal for military-grade applications, this versatile component offers fast propagation delay and high power supply current, ensuring optimal performance in demanding environments. With its complementary output polarity and compact design, this IC provides unmatched value and efficiency for your electronic projects. Upgrade your circuits today with the JM38510/32901BCA and experience the difference of Texas Instruments innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliable performance in various environments.

Propagation Delay At Nominal Supply: 50 ns

Fast propagation delay allows for quick processing of arithmetic operations, making this product suitable for real-time applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit designs, optimizing space usage.

No. of Bits: 9

Provides a high level of precision and accuracy for arithmetic calculations, making it suitable for complex digital systems.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage of 5V ensures compatibility with a wide range of digital circuits and systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various temperature conditions without impacting performance.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making it an efficient choice for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits JM38510/32901BCA attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

LS

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/32901BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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