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JM38510/31202BE

Texas Instruments

JM38510/31202BE by Texas Instruments

JM38510/31202BE by Texas Instruments is a 4-bit digital arithmetic circuit with MIL-PRF-38535 Class B screening. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 40ns. Ideal for military applications due to its MILITARY temperature grade and NO LEAD terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,034 parts In-Stock

1+ parts

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6,034

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Digiode

USA . 2,175 parts In-Stock

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2,175

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Anansix

USA . 752 parts In-Stock

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752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$14.448

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407

$14.448

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$16.040

100+ parts

-

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$11.225

10k+ parts

$11.225

50

$16.040

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$11.225

$11.225

Parana Technologies

USA . 1,105 parts In-Stock

1+ parts

$25.719

100+ parts

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$26.322

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1,105

$25.719

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$26.322

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IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$28.898

100+ parts

$27.453

1k+ parts

$26.008

10k+ parts

-

1,091

$28.898

$27.453

$26.008

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ChromeModa Solutions

Germany . 776 parts In-Stock

1+ parts

$28.898

100+ parts

$23.696

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776

$28.898

$23.696

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One Stop Electronics

USA . 292 parts In-Stock

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$63.000

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292

$63.000

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Corphita

USA . 4,559 parts In-Stock

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4,559

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DigiPath Technology Company

USA . 545 parts In-Stock

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$26.054

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545

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$26.054

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Overview

Experience unmatched quality and reliability with the JM38510/31202BE by Texas Instruments, a leading manufacturer known for its cutting-edge technology. This digital arithmetic circuit offers exceptional performance in a compact chip carrier package, making it ideal for military-grade applications. With a fast propagation delay of 40 ns and a wide operating temperature range, this product delivers precision and efficiency like no other. Trust Texas Instruments to provide you with superior products that exceed your expectations every time. Elevate your projects with the JM38510/31202BE and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent reliability and robustness, making the product suitable for harsh environments.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into existing circuit designs and increases efficiency in manufacturing.

Screening Level: MIL-PRF-38535 Class B

This screening level ensures high quality and reliability, meeting stringent military standards.

Nominal Supply Voltage: 5V

Operating at a common supply voltage simplifies design and compatibility with other components.

Propagation Delay (tpd): 40 ns

The low propagation delay results in fast signal processing, making this product suitable for time-critical applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, the product can withstand elevated temperatures without performance degradation.

Technology: TTL

TTL technology offers a good balance of speed and power consumption, making the product suitable for various digital arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits JM38510/31202BE attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class B

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

JM38510/31202BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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