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JM38510/07801BJA

Texas Instruments

JM38510/07801BJA by Texas Instruments

JM38510/07801BJA by Texas Instruments is a 4-bit digital arithmetic circuit with MIL-M-38510 Class B screening. It operates at 5V, has a propagation delay of 30ns, and temperature range from -55 to 125°C. Ideal for military applications requiring high-speed data processing in compact spaces.

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Vyrian

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Digiode

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Electronic Expediters

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Resion

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Bristol Electronics

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Dan-Mar Components

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Quantum Digital Technology

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Sunrise Surplus Inc.

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Mil-Aero Solutions, Inc.

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MISTER SPROCKETS

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Odi Ramu Company

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One Stop Electronics

USA . 1,153 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

Germany . 2,315 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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DigiPath Technology Company

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Overview

Enhance your digital arithmetic circuits with the JM38510/07801BJA from Texas Instruments. Known for their superior quality and expertise in manufacturing, Texas Instruments delivers reliable and high-performance components for a wide range of applications. This MILITARY-grade device offers precision and efficiency, making it ideal for military, aerospace, and industrial use. With a true output polarity and fast propagation delay, this product guarantees optimal performance. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, making the product suitable for harsh environments.

Screening Level: MIL-M-38510 Class B

This high screening level ensures the product meets stringent military standards, offering high performance and reliability.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can perform basic arithmetic operations efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this circuit integrates easily into existing systems.

Propagation Delay (tpd): 30 ns

The low propagation delay ensures fast operation and response time, making it suitable for real-time applications.

Technology: TTL

Using TTL technology ensures compatibility with other TTL devices and provides high noise immunity.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this circuit can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the circuit to function in extreme cold conditions as well.

Technical Specifications

Digital Arithmetic Circuits JM38510/07801BJA attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

S

JESD-30 Code:

R-GDIP-T24

Length:

31.75 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

30 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/07801BJA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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