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JM38510/12908BPA

Texas Instruments

JM38510/12908BPA by Texas Instruments

JM38510/12908BPA by Texas Instruments is a MILITARY-grade peripheral driver with 2 functions, operating at -55 to 125 °C. It has a max supply voltage of 5.5 V and output current of 0.4 A, suitable for applications requiring NAND GATE BASED PERIPHERAL DRIVER technology.

Median Price

$79.891

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 8 parts In-Stock

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$79.891

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Digiode

USA . 1,673 parts In-Stock

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$75.896

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$75.896

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Vyrian

USA . 5,043 parts In-Stock

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Electronics Depot

USA . 482 parts In-Stock

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QIE Inc.

USA . 86 parts In-Stock

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Netsource Technology, Inc.

USA . 73 parts In-Stock

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Resion

USA . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Dan-Mar Components

USA . 2 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,766 parts In-Stock

1+ parts

$2.847

100+ parts

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$3.337

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$2.847

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$3.337

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DigiPath Technology Company

USA . 300 parts In-Stock

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$3.135

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$3.135

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ChromeModa Solutions

Germany . 5,452 parts In-Stock

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$3.199

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$2.623

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$2.623

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IDEA Electronic Components Group

UK . 283 parts In-Stock

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$3.199

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$2.879

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283

$3.199

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$2.879

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AZTECH Wire

Italy . 1,072 parts In-Stock

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$14.880

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Corphita

USA . 2,042 parts In-Stock

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$71.902

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 1,121 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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Overview

Experience unrivaled quality and reliability with the JM38510/12908BPA by Texas Instruments, a top-tier manufacturer renowned for its cutting-edge technology. As a leading player in the Peripheral Drivers category, this product offers unparalleled value with its MILITARY grade components and advanced features. Perfect for applications requiring high performance and precision, the JM38510/12908BPA guarantees optimal functionality and efficiency. Trust Texas Instruments to deliver excellence, trust this product to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring reliable performance in various environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power input options, accommodating various voltage requirements.

No. of Functions: 2

Having 2 functions in one device increases efficiency and saves space on a circuit board, making it a cost-effective solution.

Screening Level: MIL-M-38510 Class B

The MIL-M-38510 Class B screening level ensures that the peripheral driver meets stringent military standards for reliability and performance.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristic allows for easy interfacing with external components, enhancing the versatility of the peripheral driver.

Technical Specifications

Peripheral Drivers JM38510/12908BPA attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

2

Input Characteristics:

GATED

JESD-30 Code:

R-GDIP-T8

JESD-609 Code:

e0

Length:

9.58 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.4 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.065 us

Turn-on Time:

.05 us

Width:

7.62 mm

Trade Compliance

JM38510/12908BPA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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