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ISO1H812GXT

Infineon Technologies

ISO1H812GXT by Infineon Technologies

Infineon's ISO1H812GXT is a 36-terminal peripheral driver with a 2.2A output peak current limit in a small outline package. It features a half-bridge interface IC and sink output current flow direction, making it ideal for various applications requiring precise control of peripherals.

Median Price

$5.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.130

10k+ parts

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800

-

-

$5.130

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$12.485

100+ parts

-

1k+ parts

-

10k+ parts

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550

$12.485

-

-

-

Digiode

USA . 768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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768

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-

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Vyrian

USA . 733 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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733

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,069 parts In-Stock

1+ parts

$1.970

100+ parts

-

1k+ parts

-

10k+ parts

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4,069

$1.970

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-

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Ampacity Inc.

Singapore . 756 parts In-Stock

1+ parts

$3.940

100+ parts

-

1k+ parts

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756

$3.940

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Semicontronic

India . 640 parts In-Stock

1+ parts

$4.230

100+ parts

$4.124

1k+ parts

$4.103

10k+ parts

-

640

$4.230

$4.124

$4.103

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$8.364

100+ parts

$8.364

1k+ parts

$8.364

10k+ parts

-

40

$8.364

$8.364

$8.364

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Modulus Dynamics

Lithuania . 3,093 parts In-Stock

1+ parts

$11.674

100+ parts

$11.207

1k+ parts

$10.740

10k+ parts

-

3,093

$11.674

$11.207

$10.740

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Corohmni

South Africa . 128 parts In-Stock

1+ parts

$11.980

100+ parts

-

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128

$11.980

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$12.235

100+ parts

-

1k+ parts

$11.746

10k+ parts

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2,000

$12.235

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$11.746

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Continental Prestige Electronics

USA . 5,684 parts In-Stock

1+ parts

$12.485

100+ parts

-

1k+ parts

-

10k+ parts

$12.235

5,684

$12.485

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-

$12.235

Argo Parts USA

USA . 4,872 parts In-Stock

1+ parts

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100+ parts

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4,872

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Corphita

USA . 393 parts In-Stock

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393

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Overview

Unlock new possibilities with the ISO1H812GXT by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality peripheral drivers that excel in performance and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Experience seamless integration, precise control, and enhanced efficiency with the ISO1H812GXT. Upgrade your systems today and see the difference Infineon can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

This feature allows for easy installation and soldering onto PCBs, making it ideal for mass production and assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard board layouts, maximizing space efficiency.

No. of Terminals: 36

With a high number of terminals, this peripheral driver can accommodate various connections and components, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the board, making it ideal for compact designs and integration.

Terminal Position: DUAL

The dual terminal position allows for flexible connections, ensuring compatibility with different circuit configurations.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, reducing the risk of signal interference or loss.

Nominal Output Peak Current Limit: 2.2 A

With a peak current limit of 2.2 A, this driver can deliver high power output for demanding applications.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge based interface IC type offers efficient and reliable performance, suitable for driving peripheral components.

Output Current Flow Direction: SINK

The sink output current flow direction allows for efficient control and regulation of current flow, ensuring optimal performance.

Technical Specifications

Peripheral Drivers ISO1H812GXT attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G36

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

2.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ISO1H812GXT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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