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ISO1H811G

Infineon Technologies

ISO1H811G by Infineon Technologies

ISO1H811G by Infineon Technologies is a Peripheral Driver with 8-bit driver, operating at -25 to 125 °C. It offers built-in protections for transient, over current, and over voltage situations. Suitable for applications requiring a max supply voltage of 30 V in a small outline package style.

Median Price

$10.170

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 997 parts In-Stock

1+ parts

$10.170

100+ parts

$6.510

1k+ parts

$4.840

10k+ parts

-

997

$10.170

$6.510

$4.840

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 244 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$3.000

-

-

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Digiode

USA . 830 parts In-Stock

1+ parts

$8.312

100+ parts

-

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-

830

$8.312

-

-

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Rutronik

Germany . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.930

10k+ parts

-

8,000

-

-

$4.930

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 314 parts In-Stock

1+ parts

$7.875

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$7.875

-

-

-

Modulus Dynamics

Lithuania . 3,792 parts In-Stock

1+ parts

$8.099

100+ parts

$7.775

1k+ parts

$7.451

10k+ parts

-

3,792

$8.099

$7.775

$7.451

-

Andel Nordic

Denmark . 383 parts In-Stock

1+ parts

$28.740

100+ parts

-

1k+ parts

$20.115

10k+ parts

$20.115

383

$28.740

-

$20.115

$20.115

Lixinc

USA . 10,446 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,446

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-

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Perfect Parts

USA . 892 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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892

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A-Z Elektronik GmbH

Germany . 435 parts In-Stock

1+ parts

-

100+ parts

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435

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Kepictronics

USA . 104 parts In-Stock

1+ parts

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104

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Overview

Infineon ISOFACE™ Coreless Transformer 8-Channel Isolated High-Side Driver family of devices are fully protected multi-channel high-side power switches providing galvanic isolation for digital output interfaces. The ISOFACE ISO1H8xxG isolated 8-channel high-side driver is intended for driving any kind of resistive, inductive, or capacitive load, addressing the exact requirements in industrial automation systems, such as Programmable Logic Controllers, Distributed Control Systems, and Industrial PCs. With complete system integration of the digital interface, coreless transformer, and power stage, these Infineon ICs can be directly connected between the microcontroller and independent power loads.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

The surface mount feature makes it easy to integrate this peripheral driver into printed circuit boards, saving space and simplifying manufacturing.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this peripheral driver is compatible with a wide range of systems and can provide reliable performance.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and longevity of the connected components by safeguarding against various electrical faults and fluctuations.

Technology: CMOS

The CMOS technology used in this peripheral driver provides low power consumption and high noise immunity, making it efficient and reliable for various applications.

Technical Specifications

Peripheral Drivers ISO1H811G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3/5,15/30

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

30 V

Minimum Supply Voltage-1:

15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

170 us

Turn-on Time:

120 us

Width:

11 mm

Trade Compliance

ISO1H811G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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