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ISO1H801G

Infineon Technologies

ISO1H801G by Infineon Technologies

ISO1H801G by Infineon Technologies is a peripheral driver with built-in protections for transient, over current, thermal, and under voltage. It operates at a max supply voltage of 5.5V and has a turn-on time of 120us. This IC type is ideal for applications requiring an interface with half bridge based peripheral drivers.

Median Price

$8.560

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,453 parts In-Stock

1+ parts

$8.560

100+ parts

$4.960

1k+ parts

$3.820

10k+ parts

-

1,453

$8.560

$4.960

$3.820

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 577 parts In-Stock

1+ parts

$6.412

100+ parts

-

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577

$6.412

-

-

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Vyrian

USA . 136 parts In-Stock

1+ parts

$6.750

100+ parts

-

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136

$6.750

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,048 parts In-Stock

1+ parts

$5.014

100+ parts

$4.813

1k+ parts

$4.613

10k+ parts

-

2,048

$5.014

$4.813

$4.613

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Ampacity Inc.

Singapore . 1,111 parts In-Stock

1+ parts

$5.740

100+ parts

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1,111

$5.740

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Corphita

USA . 268 parts In-Stock

1+ parts

$6.075

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268

$6.075

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Andel Nordic

Denmark . 61 parts In-Stock

1+ parts

$22.230

100+ parts

-

1k+ parts

$15.562

10k+ parts

$15.562

61

$22.230

-

$15.562

$15.562

Assy Fe

Spain . 13,000 parts In-Stock

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13,000

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Perfect Parts

USA . 3,884 parts In-Stock

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3,884

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Glotronic Ltd.

UK . 1,740 parts In-Stock

1+ parts

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1,740

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A-Z Elektronik GmbH

Germany . 1,707 parts In-Stock

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1,707

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

1+ parts

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1,600

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Alle Elektronik GmbH

Germany . 1,138 parts In-Stock

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1,138

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Kepictronics

USA . 78 parts In-Stock

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78

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Overview

Infineon EiceDRIVER™ Gate Driver ICs are designed for MOSFETs, IGBTs, SiC MOSFETs, and GaN HEMTs devices. EiceDRIVER™ gate drivers provide a wide range of typical output current options, from 0.1A up to 10A. These devices have robust gate drive protection features such as fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault, shutdown, and over current protection. These features make these driver ICs well-suited for both silicon and wide-bandgap power devices, including CoolGaN™, and CoolSiC™. That’s why Infineon offers more than 500 EiceDRIVER™ gate driver IC solutions suitable for any power switch, and any application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product, making it suitable for long-term use.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety of the connected devices and the driver itself, providing peace of mind during operation.

Nominal Output Peak Current Limit: 0.415 A

The high output peak current limit allows the driver to handle a variety of peripherals efficiently, making it versatile for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the driver.

Technical Specifications

Peripheral Drivers ISO1H801G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.415 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

5,15/30

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

30 V

Minimum Supply Voltage-1:

15 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

170 us

Turn-on Time:

120 us

Width:

11 mm

Trade Compliance

ISO1H801G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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