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ISO1H815G

Infineon Technologies

ISO1H815G by Infineon Technologies

ISO1H815G by Infineon Technologies is a peripheral driver with 8 bits, 36 terminals, and peak output current of 4.4A. It operates on power supplies ranging from 3.3V to 30V and features a half-bridge interface IC type for sink output current flow direction. This CMOS technology device in small outline package shape is ideal for various applications requiring precise control over peripheral devices.

Median Price

$8.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,871 parts In-Stock

1+ parts

$8.620

100+ parts

$5.670

1k+ parts

$5.200

10k+ parts

-

2,871

$8.620

$5.670

$5.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 110 parts In-Stock

1+ parts

$8.522

100+ parts

-

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-

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-

110

$8.522

-

-

-

Vyrian

USA . 891 parts In-Stock

1+ parts

$8.970

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$8.970

-

-

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Rutronik

Germany . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.050

10k+ parts

-

800

-

-

$5.050

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5 parts In-Stock

1+ parts

$3.584

100+ parts

$3.441

1k+ parts

$3.297

10k+ parts

-

5

$3.584

$3.441

$3.297

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Corphita

USA . 429 parts In-Stock

1+ parts

$8.073

100+ parts

-

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10k+ parts

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429

$8.073

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-

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Perfect Parts

USA . 5,078 parts In-Stock

1+ parts

-

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1k+ parts

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5,078

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-

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,500

-

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Netroflash

USA . 1,000 parts In-Stock

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-

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1,000

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Overview

Infineon ISOFACE™ Coreless Transformer 8-Channel Isolated High-Side Driver family of devices are fully protected multi-channel high-side power switches providing galvanic isolation for digital output interfaces. The ISOFACE ISO1H8xxG isolated 8-channel high-side driver is intended for driving any kind of resistive, inductive, or capacitive load, addressing the exact requirements in industrial automation systems, such as Programmable Logic Controllers, Distributed Control Systems, and Industrial PCs. With complete system integration of the digital interface, coreless transformer, and power stage, these Infineon ICs can be directly connected between the microcontroller and independent power loads.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for applications where weight and strength are important.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving valuable space.

Power Supplies (V): 3.3/5, 15/30

The wide range of compatible power supplies allows for flexibility in different applications, accommodating various voltage requirements.

No. of Terminals: 36

Having 36 terminals provides ample connection options and versatility in designing circuits with multiple components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making the product suitable for compact electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability of the product.

Driver No. of Bits: 8

With 8 bits, the driver can control up to 256 different states or functions, offering precise and versatile control capabilities.

Output Current Flow Direction: SINK

The sink output current flow direction allows the product to easily interface with other components in a circuit, simplifying connectivity.

Technical Specifications

Peripheral Drivers ISO1H815G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

4.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3/5,15/30

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

ISO1H815G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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