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ISO1H812G

Infineon Technologies

ISO1H812G by Infineon Technologies

ISO1H812G by Infineon Technologies is a peripheral driver with 8 bits, 2.2A output current limit, and operates on power supplies of 3.3/5V to 15/30V. It is a CMOS technology-based half bridge peripheral driver used in applications requiring sink output current flow direction and a small outline package style for compact designs.

Median Price

$10.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 20,992 parts In-Stock

1+ parts

$9.750

100+ parts

$6.440

1k+ parts

$4.980

10k+ parts

-

20,992

$9.750

$6.440

$4.980

-

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$10.626

1k+ parts

$10.015

10k+ parts

-

800

-

$10.626

$10.015

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 903 parts In-Stock

1+ parts

$8.851

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$8.851

-

-

-

Digiode

USA . 703 parts In-Stock

1+ parts

$9.386

100+ parts

-

1k+ parts

-

10k+ parts

-

703

$9.386

-

-

-

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Semtec, LLC

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,019 parts In-Stock

1+ parts

$7.520

100+ parts

-

1k+ parts

-

10k+ parts

-

14,019

$7.520

-

-

-

Corphita

USA . 548 parts In-Stock

1+ parts

$8.892

100+ parts

-

1k+ parts

-

10k+ parts

-

548

$8.892

-

-

-

CoreStaff

Japan . 800 parts In-Stock

1+ parts

$12.143

100+ parts

$6.564

1k+ parts

-

10k+ parts

-

800

$12.143

$6.564

-

-

Modulus Dynamics

Lithuania . 3,150 parts In-Stock

1+ parts

$14.365

100+ parts

$13.790

1k+ parts

$13.216

10k+ parts

-

3,150

$14.365

$13.790

$13.216

-

Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$35.680

100+ parts

-

1k+ parts

$24.979

10k+ parts

$24.979

500

$35.680

-

$24.979

$24.979

Perfect Parts

USA . 7,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,273

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,588

-

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,500

-

-

-

-

GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Glotronic Ltd.

UK . 1,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,920

-

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

-

-

-

Overview

Infineon ISOFACE™ Coreless Transformer 8-Channel Isolated High-Side Driver family of devices are fully protected multi-channel high-side power switches providing galvanic isolation for digital output interfaces. The ISOFACE ISO1H8xxG isolated 8-channel high-side driver is intended for driving any kind of resistive, inductive, or capacitive load, addressing the exact requirements in industrial automation systems, such as Programmable Logic Controllers, Distributed Control Systems, and Industrial PCs. With complete system integration of the digital interface, coreless transformer, and power stage, these Infineon ICs can be directly connected between the microcontroller and independent power loads.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight construction, making it ideal for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and integration into electronic circuits, saving space and simplifying PCB layout.

Package Shape: RECTANGULAR

The rectangular shape of the package provides versatility in placement and mounting options, accommodating different system designs.

Power Supplies (V): 3.3/5,15/30

With multiple power supply voltage options, this peripheral driver can be used in a wide range of applications, providing flexibility and compatibility.

No. of Terminals: 36

The 36 terminals offer ample connectivity options, allowing for versatile interfacing and control capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enables compact system designs, making it suitable for applications with size constraints.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections and longevity.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form factor simplifies PCB assembly and maintenance, enhancing the overall reliability and ease of use of the peripheral driver.

Driver No. of Bits: 8

With 8 driver bits, this peripheral driver can provide precise control and versatile functionality for various applications requiring fine-tuned output.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this peripheral driver is suitable for standard manufacturing and handling processes, ensuring product quality.

Nominal Output Peak Current Limit: 2.2 A

The 2.2 A peak current limit allows for reliable operation under load, ensuring that the peripheral driver can handle demanding applications with ease.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge based interface IC type offers efficient and reliable communication between the peripheral driver and external devices, enabling seamless integration into various systems.

Output Current Flow Direction: SINK

The sink output current flow direction allows for easy interfacing with external components, providing flexibility in circuit design and connectivity options.

Technical Specifications

Peripheral Drivers ISO1H812G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

2.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3/5,15/30

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

ISO1H812G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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