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JM38510/12909BPA

Texas Instruments

JM38510/12909BPA by Texas Instruments

JM38510/12909BPA by Texas Instruments is a MILITARY-grade OR GATE BASED PERIPHERAL DRIVER with 2 functions, operating at -55 to 125 °C. It has a supply voltage range of 4.5-5.5 V and peak current limit of 0.5 A, suitable for military applications requiring fast turn-on/off times and sink output current flow.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Digiode

USA . 3,463 parts In-Stock

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Vyrian

USA . 2,787 parts In-Stock

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Electronics Depot

USA . 44 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 18 parts In-Stock

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Sunrise Surplus Inc.

USA . 17 parts In-Stock

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QIE Inc.

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 4 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Parana Technologies

USA . 455 parts In-Stock

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$3.500

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$4.024

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455

$3.500

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DigiPath Technology Company

USA . 1,062 parts In-Stock

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$3.854

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$3.546

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

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$3.933

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$3.540

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$3.933

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ChromeModa Solutions

Germany . 1,750 parts In-Stock

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$3.933

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$3.225

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AZTECH Wire

Italy . 843 parts In-Stock

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$12.774

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One Stop Electronics

USA . 660 parts In-Stock

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$40.500

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Corphita

USA . 1,886 parts In-Stock

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Assy Fe

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Overview

Enhance your electronic projects with the JM38510/12909BPA from Texas Instruments, a top-tier manufacturer known for exceptional quality. This versatile peripheral driver offers unmatched reliability and durability, making it ideal for a wide range of applications. With its advanced technology and military-grade construction, this product ensures optimal performance even in harsh environments. Trust Texas Instruments to deliver superior products that provide value, benefits, and advantages to meet all your electronic needs. Elevate your projects with the JM38510/12909BPA and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan and reliable performance.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, making it versatile and compatible with a wide range of systems.

No. of Functions: 2

Offers multiple functions in a single unit, saving space and cost while increasing efficiency.

Temperature Grade: MILITARY

Designed to withstand extreme temperature ranges, making it suitable for military and industrial applications.

Nominal Output Peak Current Limit: 0.5 A

Can handle higher output currents, suitable for driving peripherals with higher power requirements.

Interface IC Type: OR GATE BASED PERIPHERAL DRIVER

Uses an OR gate based design for efficient signal processing, ensuring reliable and accurate peripheral control.

Technical Specifications

Peripheral Drivers JM38510/12909BPA attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-GDIP-T8

Length:

9.58 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.055 us

Turn-on Time:

.04 us

Width:

7.62 mm

Trade Compliance

JM38510/12909BPA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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