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JM38510/07401BCA

Texas Instruments

JM38510/07401BCA by Texas Instruments

JM38510/07401BCA by Texas Instruments is a MILITARY-grade TTL Logic Gates IC with 2 functions, 4 inputs, and 10ns propagation delay at 5V. It has a ceramic package body, glass-sealed, and operates b/w -55 to 125 °C. Ideal for applications requiring fast signal processing in harsh environments.

Median Price

$37.530

Lifecycle Status

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1k+

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Rochester

USA . 197 parts In-Stock

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$37.530

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$33.580

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$31.600

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DigiKey

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Freelance Electronics

USA . 632 parts In-Stock

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$4.059

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$4.262

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Ace Electronics

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Nova Conductors

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Digiode

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Vyrian

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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North Shore Components

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Inland Empire Components Inc.

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Prism Electronics

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Sogenti Electronics

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Electronics Depot

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Odi Ramu Company

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Resion

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Parana Technologies

USA . 1,592 parts In-Stock

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$7.520

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$8.029

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$7.520

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DigiPath Technology Company

USA . 944 parts In-Stock

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$8.281

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$7.619

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$8.281

$7.619

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ChromeModa Solutions

Germany . 3,324 parts In-Stock

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$8.450

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$6.929

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IDEA Electronic Components Group

UK . 848 parts In-Stock

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$8.450

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$8.028

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$7.605

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AZTECH Wire

Italy . 724 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Ampacity Inc.

Singapore . 144 parts In-Stock

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Component Stockers USA

USA . 1,373 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Netroflash

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USA . 34 parts In-Stock

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Overview

Unleash the power of Texas Instruments with the JM38510/07401BCA Logic Gates. Crafted with precision and reliability, this top-tier product offers unparalleled performance for your electronic projects. Whether you're a hobbyist or a seasoned professional, this component guarantees seamless integration and optimal functionality. From military-grade applications to everyday electronics, trust in Texas Instruments to deliver superior quality and unmatched value. Upgrade your circuits with the best in the industry and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Provides durability and reliability, ideal for military-grade applications.

Propagation Delay At Nominal Supply: 10 ns

Fast response time ensures quick signal processing.

No. of Functions: 2

Can perform multiple logic operations in a single component, saving space and simplifying circuit design.

Screening Level: MIL-M-38510 Class B

Meets stringent military standards for quality and performance.

No. of Inputs: 4

Allows for versatile input options to accommodate complex logic requirements.

Package Shape: RECTANGULAR

Fits easily into standard circuit layouts for convenient integration.

Nominal Supply Voltage / Vsup: 5V

Operates within common voltage ranges for compatibility with various systems.

Load Capacitance (CL): 50 pF

Balanced capacitance ensures stable and consistent performance.

No. of Terminals: 14

Provides ample connectivity for interfacing with other components.

Package Style (Meter): IN-LINE

Streamlined design for space-saving installation in circuit layouts.

Maximum I (ol): -0.4 Amp

Able to drive substantial current loads for robust signal transmission.

Propagation Delay (tpd): 5.5 ns

Ensures minimal delay in processing signals for efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides corrosion resistance and secure electrical connections.

Terminal Position: DUAL

Offers flexibility in circuit board placement for convenient installation.

Maximum Seated Height: 5.08 mm

Low-profile design for space-constrained applications.

Width: 7.62 mm

Compact size for efficient use of circuit board real estate.

Minimum Supply Voltage (Vsup): 4.5V

Can operate at lower voltages for energy-efficient performance.

Length: 19.56 mm

Standard length for compatibility with various circuit layouts.

Temperature Grade: MILITARY

Suitable for rugged environments and harsh conditions.

Technology: TTL

Utilizes proven technology for reliable logic operations.

Terminal Form: THROUGH-HOLE

Secure mounting method for stable connections.

Packing Method: TUBE

Convenient packaging for easy handling in manufacturing processes.

Terminal Pitch: 2.54 mm

Standard pitch for compatibility with common circuit boards.

Maximum Supply Voltage (Vsup): 5.5V

Can safely operate at higher voltages for flexibility in power supply options.

Maximum Power Supply Current (ICC): 22 mA

Efficient power consumption for energy-conscious applications.

Technical Specifications

Logic Gates JM38510/07401BCA attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

ANOTHER FUNCTION HAS 6 INPUT

Family:

S

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

-.4 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

JM38510/07401BCA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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