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ISO7830FDWW

Texas Instruments

ISO7830FDWW by Texas Instruments

ISO7830FDWW by Texas Instruments is a 16-terminal IC with 3 functions. It operates b/w -55 to 125 °C and supports a supply voltage range of 2.25-5.5 V. With GULL WING terminals, it's ideal for MILITARY applications requiring INTERFACE CIRCUITS in compact spaces.

Median Price

$10.642

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,345 parts In-Stock

1+ parts

$9.163

100+ parts

$8.029

1k+ parts

$4.536

10k+ parts

-

1,345

$9.163

$8.029

$4.536

-

Mouser Electronics

USA . 61 parts In-Stock

1+ parts

$12.120

100+ parts

$6.720

1k+ parts

-

10k+ parts

$6.400

61

$12.120

$6.720

-

$6.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,507 parts In-Stock

1+ parts

$8.705

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$8.705

-

-

-

Vyrian

USA . 5,902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,902

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 615 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

$4.524

10k+ parts

-

615

$4.060

-

$4.524

-

DigiPath Technology Company

USA . 1,058 parts In-Stock

1+ parts

$4.471

100+ parts

$4.113

1k+ parts

-

10k+ parts

-

1,058

$4.471

$4.113

-

-

ChromeModa Solutions

Germany . 2,561 parts In-Stock

1+ parts

$4.562

100+ parts

$3.741

1k+ parts

-

10k+ parts

-

2,561

$4.562

$3.741

-

-

IDEA Electronic Components Group

UK . 1,988 parts In-Stock

1+ parts

$4.562

100+ parts

-

1k+ parts

$4.106

10k+ parts

-

1,988

$4.562

-

$4.106

-

Corphita

USA . 3,710 parts In-Stock

1+ parts

$8.247

100+ parts

-

1k+ parts

-

10k+ parts

-

3,710

$8.247

-

-

-

Overview

Elevate your electronic designs with the Texas Instruments ISO7830FDWW, a high-quality interface circuit offering unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this small outline IC boasts three functions in a compact rectangular package, making it ideal for a wide range of applications. With a minimum supply voltage of 2.25V and maximum operating temperature of 125°C, this military-grade component is sure to meet your needs. Trust Texas Instruments for cutting-edge technology and trust the ISO7830FDWW to deliver superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on PCBs, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of voltage inputs, offering flexibility in system design.

No. of Functions: 3

Having multiple functions in a single IC simplifies circuit design, reduces component count, and saves valuable board space.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier placement on the PCB and efficient use of space, making it ideal for compact designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding conditions, increasing the product's versatility and durability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this product to function in extreme cold environments, enhancing its usability in a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making this product energy-efficient and versatile.

Technical Specifications

Other Function Interface ICs ISO7830FDWW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.3 mm

Trade Compliance

ISO7830FDWW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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