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ISO7730FQDBQQ1

Texas Instruments

ISO7730FQDBQQ1 by Texas Instruments

ISO7730FQDBQQ1 by Texas Instruments is a 16-terminal IC with 3 functions, operating at -40 to 125°C. It features a CMOS technology, AEC-Q100 screening level, and automotive-grade temperature rating. Suitable for interface circuits in automotive applications due to its small outline package and nickel/palladium/gold terminal finish.

Median Price

$2.270

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 725 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

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10k+ parts

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725

$2.270

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,648 parts In-Stock

1+ parts

$2.156

100+ parts

-

1k+ parts

-

10k+ parts

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4,648

$2.156

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Vyrian

USA . 7,499 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,714 parts In-Stock

1+ parts

$2.043

100+ parts

-

1k+ parts

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10k+ parts

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3,714

$2.043

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-

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Parana Technologies

USA . 1,952 parts In-Stock

1+ parts

$4.509

100+ parts

-

1k+ parts

$4.953

10k+ parts

-

1,952

$4.509

-

$4.953

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DigiPath Technology Company

USA . 1,114 parts In-Stock

1+ parts

$4.965

100+ parts

-

1k+ parts

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10k+ parts

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1,114

$4.965

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IDEA Electronic Components Group

UK . 783 parts In-Stock

1+ parts

$5.066

100+ parts

-

1k+ parts

$4.559

10k+ parts

-

783

$5.066

-

$4.559

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ChromeModa Solutions

Germany . 25 parts In-Stock

1+ parts

$5.066

100+ parts

$4.154

1k+ parts

-

10k+ parts

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25

$5.066

$4.154

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$10.990

100+ parts

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1k+ parts

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10k+ parts

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197

$10.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

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Overview

Unleash the power of innovation with the Texas Instruments ISO7730FQDBQQ1. This cutting-edge interface IC offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Perfect for automotive applications, this small-outline IC provides 3 functions in a compact package, ensuring optimal performance in even the most demanding environments. Elevate your designs with the superior value and benefits of the ISO7730FQDBQQ1, setting new standards in functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable packaging material for the IC, ensuring reliability and long-term performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 3

Offers multiple functions in a single IC, reducing the need for additional components and circuitry.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Provides a compact form factor for the IC, saving space on the PCB.

No. of Terminals: 16

Offers multiple connection points for interfacing with other components, enhancing the functionality of the IC.

Minimum Supply Voltage: 2.25 V

Supports low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments, ensuring reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term connectivity.

Terminal Position: DUAL

Allows for multiple terminal connections, enhancing the versatility of the IC.

Maximum Seated Height: 1.75 mm

Has a low profile design, making it suitable for applications with space constraints.

Width: 3.895 mm

Compact width dimension for space-saving on PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for efficient soldering during manufacturing.

Peak Reflow Temperature °C: 260

High temperature tolerance for reflow soldering processes, ensuring proper solder joints.

Length: 4.905 mm

Compact length dimension for space-saving on PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in harsh automotive environments.

No. of Channels: 3

Provides multiple channels for interfacing with different inputs/outputs, increasing the functionality of the IC.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: GULL WING

Gull-wing terminals provide easy soldering during PCB assembly, ensuring stable connections.

Nominal Supply Voltage: 2.5 V

Standard supply voltage for compatibility with various applications.

Terminal Pitch: 0.635 mm

Fine terminal pitch for high-density PCB designs.

Moisture Sensitivity Level (MSL): 2

Moisture-resistant packaging to prevent damage during storage and handling.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing functions, ensuring smooth communication between different components in a system.

Technical Specifications

Other Function Interface ICs ISO7730FQDBQQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7730FQDBQQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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