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ISO7320CD

Texas Instruments

ISO7320CD by Texas Instruments

ISO7320CD by Texas Instruments is a dual-function interface IC with 2 channels, operating at -40 to 125 °C. It has a small outline package style, measuring 4.905mm in length and 3.895mm in width. Suitable for automotive applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 2.

Median Price

$2.504

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,930 parts In-Stock

1+ parts

$1.360

100+ parts

$1.330

1k+ parts

$1.310

10k+ parts

-

1,930

$1.360

$1.330

$1.310

-

Texas Instruments

USA . 2,555 parts In-Stock

1+ parts

$2.834

100+ parts

$2.483

1k+ parts

$1.403

10k+ parts

-

2,555

$2.834

$2.483

$1.403

-

Mouser Electronics

USA . 290 parts In-Stock

1+ parts

$10.960

100+ parts

$7.010

1k+ parts

$5.550

10k+ parts

$5.370

290

$10.960

$7.010

$5.550

$5.370

Arrow

USA . 75 parts In-Stock

1+ parts

-

100+ parts

$2.174

1k+ parts

$1.928

10k+ parts

$1.667

75

-

$2.174

$1.928

$1.667

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,126 parts In-Stock

1+ parts

$2.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

$2.692

-

-

-

Chip Stock

USA . 16,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,587

-

-

-

-

Vyrian

USA . 6,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,992

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,198 parts In-Stock

1+ parts

$2.551

100+ parts

-

1k+ parts

-

10k+ parts

-

3,198

$2.551

-

-

-

Parana Technologies

USA . 817 parts In-Stock

1+ parts

$12.124

100+ parts

-

1k+ parts

$12.535

10k+ parts

-

817

$12.124

-

$12.535

-

DigiPath Technology Company

USA . 2,344 parts In-Stock

1+ parts

$13.351

100+ parts

-

1k+ parts

-

10k+ parts

-

2,344

$13.351

-

-

-

IDEA Electronic Components Group

UK . 1,791 parts In-Stock

1+ parts

$13.623

100+ parts

$12.942

1k+ parts

$12.261

10k+ parts

-

1,791

$13.623

$12.942

$12.261

-

ChromeModa Solutions

Germany . 77 parts In-Stock

1+ parts

$13.623

100+ parts

$11.171

1k+ parts

-

10k+ parts

-

77

$13.623

$11.171

-

-

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the ISO7320CD, a cutting-edge interface IC that offers unmatched performance and precision. Designed for automotive applications, this small outline package features dual terminals and a maximum supply voltage of 5V, ensuring seamless integration into your projects. Trust in Texas Instruments to deliver industry-leading innovation and superior functionality with the ISO7320CD, providing you with the value and benefits you need to succeed. Elevate your designs with this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material suitable for various applications.

Surface Mount: YES

Easy to install and suitable for automated assembly processes.

Maximum Supply Voltage: 5 V

Can handle standard voltage levels, ensuring compatibility with most systems.

No. of Functions: 2

Offers multiple functions in a single component, saving space and simplifying circuit design.

Package Shape: RECTANGULAR

Compact shape that fits well in tight spaces or on crowded circuit boards.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components or circuitry.

Package Style (Meter): SMALL OUTLINE

Space-saving design ideal for compact electronic devices.

Minimum Supply Voltage: 3.3 V

Operates at low voltage levels, conserving power and reducing heat generation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish that enhances conductivity and prevents corrosion.

Terminal Position: DUAL

Provides redundancy and flexibility in connecting to other components.

Maximum Seated Height: 1.75 mm

Low profile design suitable for slim electronic devices.

Width: 3.895 mm

Compact width for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures during assembly processes.

Peak Reflow Temperature °C: 260

High reflow temperature capability for soldering without damage.

Length: 4.905 mm

Compact length for efficient use of board space.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in vehicles.

No. of Channels: 2

Multiple channels for handling data or signals concurrently.

Terminal Form: GULL WING

Enhanced mechanical strength and stability for soldered connections.

Nominal Supply Voltage: 3.3 V

Stable operating voltage for consistent performance.

Terminal Pitch: 1.27 mm

Optimal spacing between terminals for easy soldering and connection.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level for safe storage and handling.

Interface IC Type: INTERFACE CIRCUIT

Specialized for interface circuit applications, ensuring compatibility and reliability.

Technical Specifications

Other Function Interface ICs ISO7320CD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

VCC2 SUPPLY FROM 3 TO 5.5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7320CD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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