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ISO7241CDWG4

Texas Instruments

ISO7241CDWG4 by Texas Instruments

ISO7241CDWG4 by Texas Instruments is a digital isolator with 4 channels, CMOS technology, and 3.3V nominal voltage. It comes in a small outline package with dual terminals for automotive applications. Operating temperature ranges from -40 to 125°C, making it suitable for various industrial uses.

Median Price

$5.300

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$5.300

100+ parts

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550

$5.300

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Chip Stock

USA . 34,868 parts In-Stock

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34,868

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Vyrian

USA . 4,728 parts In-Stock

1+ parts

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4,728

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Digiode

USA . 2,993 parts In-Stock

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2,993

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Tectiva GmbH

Germany . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

$4.215

100+ parts

-

1k+ parts

$4.651

10k+ parts

-

1,221

$4.215

-

$4.651

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DigiPath Technology Company

USA . 410 parts In-Stock

1+ parts

$4.641

100+ parts

$4.270

1k+ parts

-

10k+ parts

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410

$4.641

$4.270

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ChromeModa Solutions

Germany . 5,498 parts In-Stock

1+ parts

$4.736

100+ parts

$3.884

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-

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5,498

$4.736

$3.884

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IDEA Electronic Components Group

UK . 178 parts In-Stock

1+ parts

$4.736

100+ parts

-

1k+ parts

$4.262

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178

$4.736

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$4.262

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Continental Prestige Electronics

USA . 3,690 parts In-Stock

1+ parts

$5.300

100+ parts

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$5.194

3,690

$5.300

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$5.194

Netroflash

USA . 500 parts In-Stock

1+ parts

$5.300

100+ parts

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1k+ parts

$5.035

10k+ parts

$4.929

500

$5.300

-

$5.035

$4.929

Corohmni

South Africa . 347 parts In-Stock

1+ parts

$7.273

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347

$7.273

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AZTECH Wire

Italy . 543 parts In-Stock

1+ parts

$7.717

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543

$7.717

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Advanced Electronics

New Zealand . 982 parts In-Stock

1+ parts

$10.757

100+ parts

$10.219

1k+ parts

$10.219

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982

$10.757

$10.219

$10.219

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Semicontronic

India . 152 parts In-Stock

1+ parts

$11.500

100+ parts

$11.212

1k+ parts

$11.155

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152

$11.500

$11.212

$11.155

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Ampacity Inc.

Singapore . 544 parts In-Stock

1+ parts

$14.500

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544

$14.500

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One Stop Electronics

USA . 518 parts In-Stock

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$50.500

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518

$50.500

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Corphita

USA . 3,085 parts In-Stock

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3,085

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Argo Parts USA

USA . 1,627 parts In-Stock

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1,627

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A-Z Elektronik GmbH

Germany . 567 parts In-Stock

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567

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Overview

Discover the innovative ISO7241CDWG4 by Texas Instruments, a top-tier manufacturer known for its high-quality products. This digital isolator offers unparalleled value with its versatility and reliability, making it perfect for a wide range of applications in the automotive industry and beyond. With four functions in one compact package, this IC provides efficiency and peace of mind to customers looking for a superior solution. Upgrade your projects with the ISO7241CDWG4 and experience the advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5 V

Can handle a higher supply voltage, providing flexibility in power input options.

No. of Functions: 4

With multiple functions in one IC, it offers cost-efficiency and space-saving benefits by reducing the need for multiple components.

Package Shape: RECTANGULAR

Rectangular shape is standard and facilitates easy integration into existing PCB layouts.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, allowing for versatile connectivity options.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for demanding industrial or automotive environments.

Minimum Operating Temperature: -40 °C

Operational in low-temperature conditions, ensuring reliability in various environmental settings.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances the terminal's conductivity, ensuring reliable signal transmission and preventing corrosion.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout options and ease of connection.

No. of Channels: 4

Multiple channels enable simultaneous data transfer, enhancing overall performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the energy efficiency and reliability of the IC.

Nominal Supply Voltage: 3.3 V

Standard supply voltage requirement makes it compatible with various power sources and easy to integrate into existing systems.

Technical Specifications

Other Function Interface ICs ISO7241CDWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.15V TO 5.5V VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7241CDWG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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