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ISO7240CFDWG4

Texas Instruments

ISO7240CFDWG4 by Texas Instruments

ISO7240CFDWG4 by Texas Instruments is a digital isolator with 4 channels, CMOS technology, and 3.3V nominal voltage. It comes in a small outline package with dual terminal position for automotive applications. Operating temperature ranges from -40 to 125°C, making it suitable for various industrial environments.

Median Price

$4.478

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$5.415

1k+ parts

$3.542

10k+ parts

$3.384

10

-

$5.415

$3.542

$3.384

Verical

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.542

10k+ parts

$3.384

10

-

-

$3.542

$3.384

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$4.390

-

-

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Vyrian

USA . 1,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,907

-

-

-

-

Digiode

USA . 215 parts In-Stock

1+ parts

-

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-

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215

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 44 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$2.328

-

-

-

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$3.010

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.010

-

-

-

Semicontronic

India . 10 parts In-Stock

1+ parts

$3.010

100+ parts

$2.935

1k+ parts

$2.920

10k+ parts

-

10

$3.010

$2.935

$2.920

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$3.824

100+ parts

$3.633

1k+ parts

$3.633

10k+ parts

-

600

$3.824

$3.633

$3.633

-

Argo Parts USA

USA . 2,481 parts In-Stock

1+ parts

$3.840

100+ parts

-

1k+ parts

-

10k+ parts

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2,481

$3.840

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Continental Prestige Electronics

USA . 2,166 parts In-Stock

1+ parts

$3.840

100+ parts

-

1k+ parts

-

10k+ parts

$3.763

2,166

$3.840

-

-

$3.763

Parana Technologies

USA . 849 parts In-Stock

1+ parts

$12.890

100+ parts

-

1k+ parts

$13.372

10k+ parts

-

849

$12.890

-

$13.372

-

DigiPath Technology Company

USA . 1,955 parts In-Stock

1+ parts

$14.193

100+ parts

$13.058

1k+ parts

-

10k+ parts

-

1,955

$14.193

$13.058

-

-

ChromeModa Solutions

Germany . 1,255 parts In-Stock

1+ parts

$14.483

100+ parts

$11.876

1k+ parts

-

10k+ parts

-

1,255

$14.483

$11.876

-

-

IDEA Electronic Components Group

UK . 1,234 parts In-Stock

1+ parts

$14.483

100+ parts

$13.759

1k+ parts

$13.035

10k+ parts

-

1,234

$14.483

$13.759

$13.035

-

AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$14.832

100+ parts

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831

$14.832

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Corphita

USA . 1,104 parts In-Stock

1+ parts

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1,104

-

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Perfect Parts

USA . 25 parts In-Stock

1+ parts

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100+ parts

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25

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Overview

Unlock a world of seamless connectivity and reliable performance with the Texas Instruments ISO7240CFDWG4 digital isolator. Manufactured with precision and expertise, this product is designed to meet the highest standards of quality and efficiency. Ideal for a wide range of applications in the automotive industry and beyond, this digital isolator offers unparalleled value, benefits, and advantages to customers seeking a robust and dependable solution. Trust in Texas Instruments to deliver exceptional performance and peace of mind with the ISO7240CFDWG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

The surface mount option allows for easy and convenient installation on PCBs.

Maximum Supply Voltage: 5 V

With a high maximum supply voltage, this product can be used in a wide range of applications.

No. of Functions: 4

The multiple functions provided by this IC make it a versatile and cost-effective choice.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board.

No. of Terminals: 16

The ample number of terminals enable seamless connectivity within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and enhances the overall design of the product.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures energy efficiency and compatibility with various systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and prevents corrosion.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and installation.

Maximum Seated Height: 2.65 mm

The low maximum seated height is beneficial for compact designs and space-constrained applications.

Width: 7.5 mm

The narrow width of the IC allows for efficient use of space on a PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering and robust connections.

Length: 10.3 mm

The compact length of the IC contributes to space-saving and efficient board layout.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature tolerance makes this IC suitable for use in automotive applications.

No. of Channels: 4

The multiple channels provide flexibility and versatility in signal processing and data transmission.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed performance.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and secure connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting and efficient use of space.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this IC is suitable for a wide range of manufacturing and storage environments.

Interface IC Type: DIGITAL ISOLATOR

The digital isolator interface IC type provides electrical isolation and signal integrity in sensitive applications.

Technical Specifications

Other Function Interface ICs ISO7240CFDWG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.15V TO 5.5V VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7240CFDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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