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ISO150AUE4

Texas Instruments

ISO150AUE4 by Texas Instruments

The Texas Instruments ISO150AUE4 is a BICMOS technology telecom IC with 2 functions. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 5V. With a small outline package style, it is suitable for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,013 parts In-Stock

1+ parts

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6,013

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Digiode

USA . 2,852 parts In-Stock

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2,852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$7.464

100+ parts

-

1k+ parts

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304

$7.464

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Parana Technologies

USA . 1,365 parts In-Stock

1+ parts

$9.425

100+ parts

-

1k+ parts

$10.043

10k+ parts

-

1,365

$9.425

-

$10.043

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ChromeModa Solutions

Germany . 2,734 parts In-Stock

1+ parts

$10.590

100+ parts

$8.684

1k+ parts

-

10k+ parts

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2,734

$10.590

$8.684

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IDEA Electronic Components Group

UK . 2,376 parts In-Stock

1+ parts

$10.590

100+ parts

$10.060

1k+ parts

$9.531

10k+ parts

-

2,376

$10.590

$10.060

$9.531

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One Stop Electronics

USA . 237 parts In-Stock

1+ parts

$162.000

100+ parts

-

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237

$162.000

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Semicontronic

India . 439 parts In-Stock

1+ parts

$684.000

100+ parts

$666.900

1k+ parts

$663.480

10k+ parts

-

439

$684.000

$666.900

$663.480

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Ampacity Inc.

Singapore . 795 parts In-Stock

1+ parts

$700.000

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795

$700.000

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Corphita

USA . 3,287 parts In-Stock

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3,287

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DigiPath Technology Company

USA . 590 parts In-Stock

1+ parts

-

100+ parts

$9.548

1k+ parts

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590

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$9.548

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Corohmni

South Africa . 178 parts In-Stock

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178

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Overview

Enhance your telecom interface systems with the Texas Instruments ISO150AUE4. Designed with precision and quality in mind, this product offers customers unparalleled value and benefits. Whether you're looking to improve communication networks or enhance connectivity in your devices, this versatile IC is the perfect solution. Trust in Texas Instruments' reputation for excellence and upgrade your systems today with the ISO150AUE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the package is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 2

Having multiple functions in a single IC provides more functionality and versatility in telecom applications.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a compact and space-saving design, ideal for applications where board real estate is limited.

No. of Terminals: 12

The high number of terminals allows for more connectivity options, enabling the IC to interface with other components effectively.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making it suitable for telecom applications where temperature fluctuations are common.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes it compatible with many existing systems and reduces the need for additional components for voltage regulation.

Technical Specifications

Other Function Telecom Interface ICs ISO150AUE4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO150AUE4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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