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ISO150AUG4

Texas Instruments

ISO150AUG4 by Texas Instruments

The Texas Instruments ISO150AUG4 is a BICMOS technology telecom IC with 2 functions, suitable for industrial applications. It operates b/w -40 to 85°C, with a supply voltage of 5V. The package is small outline, rectangular in shape, with Gull Wing terminals and nickel palladium gold finish.

Median Price

$10.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26 parts In-Stock

1+ parts

$10.630

100+ parts

$10.420

1k+ parts

$10.200

10k+ parts

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26

$10.630

$10.420

$10.200

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,439 parts In-Stock

1+ parts

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4,439

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Digiode

USA . 2,629 parts In-Stock

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2,629

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Distributors (Availability)

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$5.681

100+ parts

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248

$5.681

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Parana Technologies

USA . 219 parts In-Stock

1+ parts

$12.209

100+ parts

-

1k+ parts

$12.626

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219

$12.209

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$12.626

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DigiPath Technology Company

USA . 1,950 parts In-Stock

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$13.444

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1,950

$13.444

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IDEA Electronic Components Group

UK . 1,260 parts In-Stock

1+ parts

$13.718

100+ parts

$13.032

1k+ parts

$12.346

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-

1,260

$13.718

$13.032

$12.346

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ChromeModa Solutions

Germany . 681 parts In-Stock

1+ parts

$13.718

100+ parts

$11.249

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681

$13.718

$11.249

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Semicontronic

India . 1,433 parts In-Stock

1+ parts

$44.000

100+ parts

$42.900

1k+ parts

$42.680

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1,433

$44.000

$42.900

$42.680

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Ampacity Inc.

Singapore . 272 parts In-Stock

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$319.000

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272

$319.000

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One Stop Electronics

USA . 1,027 parts In-Stock

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$358.000

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1,027

$358.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,925 parts In-Stock

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21,925

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Corohmni

South Africa . 341 parts In-Stock

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341

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Corphita

USA . 287 parts In-Stock

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287

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Perfect Parts

USA . 8 parts In-Stock

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8

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Overview

Step into a world of seamless connectivity with the Texas Instruments ISO150AUG4, a high-quality telecom interface IC that offers unmatched performance and reliability. Manufactured by a trusted industry leader, this product is designed to meet the demands of various applications in the telecommunications sector. With its advanced technology and superior design, the ISO150AUG4 ensures optimal functionality and efficiency. Experience the value and benefits of this innovative solution, providing customers with a competitive edge in today's fast-paced market. Choose Texas Instruments for cutting-edge solutions that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product suitable for various applications while keeping it cost-effective.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in one IC reduces the need for additional components, saving on board space and simplifying the design.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability and stability in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function in extreme cold conditions without performance degradation.

Nominal Supply Voltage: 5 V

Standard supply voltage makes integration with existing systems easier and more efficient.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, ideal for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ISO150AUG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO150AUG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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