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ISO150AU-1

Texas Instruments

ISO150AU-1 by Texas Instruments

ISO150AU-1 by Texas Instruments is a BICMOS technology telecom IC with 2 functions. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 5V. This small outline package (17.9x7.5mm) with gull wing terminals is suitable for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,638 parts In-Stock

1+ parts

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2,638

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Digiode

USA . 2,380 parts In-Stock

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2,380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 387 parts In-Stock

1+ parts

$5.497

100+ parts

$510.446

1k+ parts

$4.947

10k+ parts

-

387

$5.497

$510.446

$4.947

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DigiPath Technology Company

USA . 1,613 parts In-Stock

1+ parts

$6.052

100+ parts

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1,613

$6.052

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ChromeModa Solutions

Germany . 920 parts In-Stock

1+ parts

$6.176

100+ parts

$5.064

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-

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920

$6.176

$5.064

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IDEA Electronic Components Group

UK . 899 parts In-Stock

1+ parts

$6.176

100+ parts

-

1k+ parts

$5.558

10k+ parts

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899

$6.176

-

$5.558

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$16.559

100+ parts

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451

$16.559

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One Stop Electronics

USA . 1,065 parts In-Stock

1+ parts

$158.000

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1,065

$158.000

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Ampacity Inc.

Singapore . 852 parts In-Stock

1+ parts

$317.000

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852

$317.000

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Semicontronic

India . 434 parts In-Stock

1+ parts

$968.000

100+ parts

$943.800

1k+ parts

$938.960

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434

$968.000

$943.800

$938.960

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Corphita

USA . 3,242 parts In-Stock

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3,242

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Corohmni

South Africa . 339 parts In-Stock

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339

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Overview

Elevate your telecom interface performance with the ISO150AU-1 by Texas Instruments. Crafted with precision and quality, this innovative product offers unmatched reliability and functionality in the telecom IC category. Whether you're looking to enhance communication systems or streamline data transmission, this small outline package delivers exceptional value and benefits. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and propels your projects to new heights. Choose the ISO150AU-1 for superior performance and unparalleled advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the IC, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

No. of Functions: 2

Having 2 functions in a single IC reduces the need for multiple components, simplifying the design and potentially reducing costs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board, maximizing the layout and design options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can function reliably even in demanding industrial environments.

Technology: BICMOS

The BICMOS technology used in the IC offers a combination of benefits from both bipolar and CMOS technologies, such as high speed and low power consumption.

Nominal Supply Voltage: 5 V

With a standard nominal supply voltage of 5V, this IC can easily integrate into existing systems without the need for additional voltage regulation.

Technical Specifications

Other Function Telecom Interface ICs ISO150AU-1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

17.9 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

ISO150AU-1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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