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ISO150AP

Texas Instruments

ISO150AP by Texas Instruments

The Texas Instruments ISO150AP is a BICMOS technology telecom IC with 2 functions. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 5V. With an in-line package style, it is ideal for telecom circuit applications requiring precise signal processing.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 6,144 parts In-Stock

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Digiode

USA . 2,109 parts In-Stock

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Bristol Electronics

USA . 17 parts In-Stock

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PC Components Company LLC

USA . 9 parts In-Stock

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A2Z Electronics, Inc.

USA . 1 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 706 parts In-Stock

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$5.133

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706

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Parana Technologies

USA . 2,345 parts In-Stock

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$8.006

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$8.584

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DigiPath Technology Company

USA . 1,138 parts In-Stock

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$8.816

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$8.111

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ChromeModa Solutions

Germany . 3,953 parts In-Stock

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$8.996

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$7.377

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IDEA Electronic Components Group

UK . 1,680 parts In-Stock

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$8.996

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$8.546

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$8.096

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One Stop Electronics

USA . 1,773 parts In-Stock

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$910.000

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Perfect Parts

USA . 1,456 parts In-Stock

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Corphita

USA . 845 parts In-Stock

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Assy Fe

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Overview

Elevate your telecommunications projects with the Texas Instruments ISO150AP. Crafted with precision and expertise, this telecom interface IC boasts unrivaled quality and reliability. From its durable plastic/epoxy body to its advanced BICMOS technology, this product is designed to exceed expectations. Perfect for a range of applications, the ISO150AP offers seamless integration and exceptional performance. Experience the value and benefits of Texas Instruments' innovative solution today. Elevate your projects with the ISO150AP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making it a reliable choice for the package body of this IC.

No. of Functions: 2

Having 2 functions in one IC allows for more versatility and functionality in telecom interface applications.

Package Shape: RECTANGULAR

Rectangular package shape is efficient for space-saving in design layout and integration.

No. of Terminals: 12

With 12 terminals, this IC can support multiple connections and configurations for telecom interfaces.

Package Style (Meter): IN-LINE

In-line package style simplifies installation and connection processes, enhancing ease of use.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold climates or environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options for different applications.

Maximum Seated Height: 5.33 mm

Low maximum seated height enables compact design solutions in telecom interface setups.

Width: 7.62 mm

Narrow width facilitates installation in confined spaces or tight layouts.

Length: 29.905 mm

Optimal length offers balance between compact size and functionality for telecom interface requirements.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies soldering and assembly processes for secure connections.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC is optimized for efficient communication functions.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage compatibility ensures easy integration with existing systems.

Terminal Pitch: 2.54 mm

Standard 2.54mm terminal pitch allows for compatibility with common connector types for easy connections.

Technical Specifications

Other Function Telecom Interface ICs ISO150AP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T12

Length:

29.905 mm

No. of Functions:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

ISO150AP Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

NSN

5962-01-497-2516, 5962014972516

NIIN

014972516

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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