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HPA02316MDCAR

Texas Instruments

HPA02316MDCAR by Texas Instruments

Texas Instruments' HPA02316MDCAR is a 48-terminal audio amplifier with 10W output power, suitable for applications requiring small outline and thin profile packages. With a gain of 4dB and nominal noise figure of 106dB, it operates b/w temperatures of 0-85°C, making it ideal for compact audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,074

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-

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Digiode

USA . 3,876 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,876

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 612 parts In-Stock

1+ parts

$0.816

100+ parts

-

1k+ parts

$1.789

10k+ parts

-

612

$0.816

-

$1.789

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DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

$0.899

100+ parts

$0.827

1k+ parts

-

10k+ parts

-

325

$0.899

$0.827

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ChromeModa Solutions

Germany . 2,860 parts In-Stock

1+ parts

$0.917

100+ parts

$0.752

1k+ parts

-

10k+ parts

-

2,860

$0.917

$0.752

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-

IDEA Electronic Components Group

UK . 687 parts In-Stock

1+ parts

$0.917

100+ parts

-

1k+ parts

$0.825

10k+ parts

-

687

$0.917

-

$0.825

-

One Stop Electronics

USA . 597 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

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597

$8.800

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AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$19.325

100+ parts

-

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482

$19.325

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Microchip USA

USA . 2,756 parts In-Stock

1+ parts

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2,756

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Corphita

USA . 2,349 parts In-Stock

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2,349

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Overview

Elevate your audio experience with the HPA02316MDCAR by Texas Instruments, a top-of-the-line audio amplifier designed to deliver unparalleled sound quality and performance. Manufactured by the industry leader in electronics, this product boasts a sleek design and advanced features that cater to a wide range of applications in the audio and video industry. With a compact package style and high-quality materials, this amplifier offers customers exceptional value, benefits, and advantages, making it the perfect choice for enhancing your audio setup. Experience the difference with the HPA02316MDCAR and elevate your audio experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the amplifier, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Output Power: 10 W

Provides sufficient power for high-quality audio output, making it suitable for various applications.

No. of Channels: 2

Offers stereo sound output, enhancing the overall audio experience for users.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, increasing reliability.

Minimum Supply Voltage (Vsup): 3 V

Can operate at lower voltages, making it energy-efficient and suitable for portable devices.

Gain: 4 dB

Provides amplification of the input signal, enhancing the overall audio quality.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate levels of moisture, making it suitable for a variety of environments.

Technical Specifications

Audio & Video Amplifiers HPA02316MDCAR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

4 dB

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

3

Nominal Noise Figure:

106 dB

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

10 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

HPA02316MDCAR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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