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FCT162823CTPVCTG4

Texas Instruments

FCT162823CTPVCTG4 by Texas Instruments

FCT162823CTPVCTG4 by Texas Instruments is a 9-bit bus driver with 2 functions, featuring a propagation delay of 6 ns and operating temperature range from -40 to 85 °C. Ideal for industrial applications requiring true output polarity and positive edge trigger type in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,085 parts In-Stock

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Digiode

USA . 2,433 parts In-Stock

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2,433

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Distributors (Availability)

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Andel Nordic

Denmark . 1,461 parts In-Stock

1+ parts

$7.665

100+ parts

-

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$7.358

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$7.358

1,461

$7.665

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$7.358

$7.358

Parana Technologies

USA . 404 parts In-Stock

1+ parts

$8.429

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$9.068

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404

$8.429

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$9.068

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DigiPath Technology Company

USA . 482 parts In-Stock

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$9.282

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482

$9.282

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ChromeModa Solutions

Germany . 2,825 parts In-Stock

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$9.471

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$7.766

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2,825

$9.471

$7.766

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IDEA Electronic Components Group

UK . 650 parts In-Stock

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$9.471

100+ parts

$8.997

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$8.524

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650

$9.471

$8.997

$8.524

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AZTECH Wire

Italy . 341 parts In-Stock

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$17.025

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$17.025

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One Stop Electronics

USA . 1,352 parts In-Stock

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$48.000

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Corphita

USA . 4,794 parts In-Stock

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Northwest PG Solutions

USA . 1,384 parts In-Stock

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Native Components

USA . 537 parts In-Stock

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Microchip USA

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Overview

Experience the superior quality and reliability of Texas Instruments with the FCT162823CTPVCTG4 Bus Driver & Transceivers. This versatile component offers seamless integration, fast propagation delay, and a wide range of applications, making it an essential choice for your electronics projects. Benefit from the advanced technology, high performance, and unmatched value that Texas Instruments is known for, and take your designs to the next level with the FCT162823CTPVCTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures quick and efficient data transmission.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Offers multiple functions in a single component, increasing functionality and reducing the need for separate components.

Package Shape: RECTANGULAR

Standard shape for easy mounting and compatibility with various devices.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for driving loads with moderate capacitance, ensuring stability in signal transmission.

Power Supplies (V): 5

Consistent power supply for reliable performance.

No. of Terminals: 56

Sufficient terminals for connecting various components and interfaces.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design for space-saving and efficient PCB layout.

Maximum I (ol): 24 Amp

High output current capability for driving heavy loads.

Propagation Delay (tpd): 12.5 ns

Fast propagation delay for quick data transmission.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, suitable for industrial applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Provides flexibility in output control and protection against overloads.

Trigger Type: POSITIVE EDGE

Accurate triggering mechanism for precise data transmission.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Corrosion-resistant finish for long-lasting performance.

Terminal Position: DUAL

Proper positioning for easy installation and connectivity.

No. of Ports: 2

Multiple ports for versatile connectivity options.

Maximum Seated Height: 2.79 mm

Low profile design for space-efficient installations.

Width: 7.49 mm

Compact width for efficient use of board space.

Output Polarity: TRUE

Correct output polarity for accurate signal transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Can operate at lower supply voltages, providing flexibility in power requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Safe reflow time to prevent component damage during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering.

Length: 18.415 mm

Standard length for compatibility with various mounting configurations.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure solder connections.

Packing Method: TR

Tape and reel packaging for easy handling and assembly.

Terminal Pitch: 0.635 mm

Fine pitch terminals for high-density mounting and efficient PCB design.

Maximum Supply Voltage (Vsup): 5.5 V

Safe maximum supply voltage for reliable operation and protection against voltage spikes.

Technical Specifications

Bus Driver & Transceivers FCT162823CTPVCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

FCT162823CTPVCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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