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FCT162823CTPACTE4

Texas Instruments

FCT162823CTPACTE4 by Texas Instruments

FCT162823CTPACTE4 by Texas Instruments is a 9-bit bus driver with 2 functions, featuring a propagation delay of 6 ns and operating temperature range from -40 to 85 °C. It is ideal for industrial applications requiring a true output polarity, positive edge trigger type, and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,983 parts In-Stock

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Digiode

USA . 1,865 parts In-Stock

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Native Components

USA . 53 parts In-Stock

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$1.959

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Northwest PG Solutions

USA . 1,264 parts In-Stock

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$2.155

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$2.155

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Andel Nordic

Denmark . 5,615 parts In-Stock

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$5.903

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$5.667

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AZTECH Wire

Italy . 460 parts In-Stock

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$12.555

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Parana Technologies

USA . 1,284 parts In-Stock

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$28.400

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$47.011

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DigiPath Technology Company

USA . 854 parts In-Stock

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$31.272

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$28.770

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854

$31.272

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IDEA Electronic Components Group

UK . 792 parts In-Stock

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$31.910

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$30.314

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$28.719

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ChromeModa Solutions

Germany . 490 parts In-Stock

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$31.910

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$26.166

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One Stop Electronics

USA . 1,243 parts In-Stock

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$55.000

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Component Stockers USA

USA . 536 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,771 parts In-Stock

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Microchip USA

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Corphita

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Overview

Enhance your electronic designs with the FCT162823CTPACTE4 by Texas Instruments, a top-notch solution in the Bus Driver & Transceivers category. Crafted with precision using high-quality materials, this product offers reliable performance and exceptional durability. Ideal for a wide range of applications, this bus driver excels at providing quick propagation delay and efficient power management. Elevate your projects with the Texas Instruments advantage and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and can withstand varying environmental conditions, making this product suitable for long-term use.

Propagation Delay At Nominal Supply: 6 ns

With a low propagation delay, this product can quickly transmit signals, ensuring efficient communication within a bus driver/transceiver system.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional parts, leading to a more streamlined and cost-effective solution.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in minimizing signal distortion and maintaining signal integrity, making this product ideal for high-speed data transmission.

Power Supplies (V): 5

Operating at 5V power supply simplifies the system design and enhances reliability, as 5V is a standard voltage level in many electronic applications.

No. of Terminals: 56

Having a high number of terminals allows for more connectivity options, enabling versatile configurations and connectivity in bus driver/transceiver applications.

Maximum I (ol): 24 Amp

The high output current capability of 24 Amp ensures that this product can drive loads with high current requirements, making it suitable for demanding applications.

Propagation Delay (tpd): 12.5 ns

The low propagation delay of 12.5 ns results in fast signal transmission, reducing latency and improving overall system performance in bus driver/transceiver operations.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

The 3-state output with series resistor provides flexibility in controlling the output state, allowing for tristate operation and effective bus sharing in a multi-drop network.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate signal synchronization, enabling precise data transfer and reliable communication in bus driver/transceiver applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C allows for reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring reliable connections in bus driver/transceiver applications.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product offers a safe operating range while providing a margin for voltage spikes, enhancing the overall robustness and reliability of the system.

Technical Specifications

Bus Driver & Transceivers FCT162823CTPACTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

FCT162823CTPACTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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