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DS25BR110TSD

Texas Instruments

DS25BR110TSD by Texas Instruments

DS25BR110TSD by Texas Instruments is a Line Driver with 3.6V max supply, 0.465ns max transmit delay, and 8 terminals. Ideal for industrial applications requiring differential output and operating temperatures from -40 to 85°C. Suitable for surface mount with small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,268 parts In-Stock

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Vyrian

USA . 2,035 parts In-Stock

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Anansix

USA . 626 parts In-Stock

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EMSNET

USA . 46 parts In-Stock

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Native Components

USA . 762 parts In-Stock

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$0.735

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762

$0.735

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Northwest PG Solutions

USA . 2,374 parts In-Stock

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$0.809

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Parana Technologies

USA . 1,035 parts In-Stock

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$11.306

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$11.739

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$11.306

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AZTECH Wire

Italy . 190 parts In-Stock

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$12.261

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$12.261

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DigiPath Technology Company

USA . 2,194 parts In-Stock

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$12.449

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$11.453

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ChromeModa Solutions

Germany . 1,579 parts In-Stock

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$12.703

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$10.416

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IDEA Electronic Components Group

UK . 172 parts In-Stock

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$12.703

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$12.068

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$11.433

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One Stop Electronics

USA . 918 parts In-Stock

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$38.500

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Lixinc

USA . 18,173 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 4,031 parts In-Stock

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Overview

Discover the DS25BR110TSD by Texas Instruments, a top-quality line driver boasting exceptional performance and reliability. Perfect for a wide range of applications, this product offers unmatched value and benefits to customers looking for a high-quality solution. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this line driver will exceed your expectations. Upgrade your system with the DS25BR110TSD and experience superior performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a high supply voltage, providing flexibility in various applications.

Package Shape: SQUARE

Square package shape is compact and easily mountable on circuit boards.

Maximum Transmit Delay: 0.465 ns

Low transmit delay ensures fast and efficient signal transmission.

No. of Terminals: 8

Sufficient terminals for connecting to other components and circuits.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink feature promotes efficient heat dissipation and space-saving.

Minimum Supply Voltage: 3 V

Supports low supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without compromising performance.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connection options.

Maximum Seated Height: 0.8 mm

Low seated height helps in compact design and space-saving on circuit boards.

Width: 3 mm

Narrow width facilitates compact placement on circuit boards.

Differential Output: YES

Differential output helps in reducing noise and improving signal integrity in communication.

Length: 3 mm

Short length allows for space-saving and compact placement on circuit boards.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with reliable performance in challenging environments.

Terminal Form: NO LEAD

No lead terminal form provides a clean and compact appearance on circuit boards.

Input Characteristics: DIFFERENTIAL

Differential input ensures better noise rejection and signal integrity in communication.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact design and efficient space utilization on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has moderate sensitivity to moisture, requiring proper handling and storage.

Interface IC Type: LINE DRIVER

Designed as a line driver interface IC for efficient signal transmission and reception.

Technical Specifications

Line Drivers & Receivers DS25BR110TSD attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR110TSD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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