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DS25BR120TSDX/NOPB

Texas Instruments

DS25BR120TSDX/NOPB by Texas Instruments

DS25BR120TSDX/NOPB by Texas Instruments is a line driver with 3.3V power supply, 0.465 ns max transmit delay, and -40 to 85°C operating temp range. Ideal for industrial applications requiring differential output and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,383 parts In-Stock

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Digiode

USA . 2,094 parts In-Stock

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Anansix

USA . 1,509 parts In-Stock

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Nova Conductors

Japan . 71 parts In-Stock

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Semicontronic

India . 1,549 parts In-Stock

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$4.500

100+ parts

$4.388

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$4.365

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1,549

$4.500

$4.388

$4.365

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Parana Technologies

USA . 2,136 parts In-Stock

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$5.310

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$5.949

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$5.310

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$5.949

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DigiPath Technology Company

USA . 1,040 parts In-Stock

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$5.847

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$5.847

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ChromeModa Solutions

Germany . 516 parts In-Stock

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$5.966

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$4.892

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516

$5.966

$4.892

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IDEA Electronic Components Group

UK . 255 parts In-Stock

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$5.966

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$5.369

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$5.966

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$5.369

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Ampacity Inc.

Singapore . 202 parts In-Stock

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$6.500

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$6.500

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Corohmni

South Africa . 5 parts In-Stock

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$6.694

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One Stop Electronics

USA . 1,392 parts In-Stock

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$18.500

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AZTECH Wire

Italy . 701 parts In-Stock

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$18.859

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Continental Prestige Electronics

USA . 6,514 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Argo Parts USA

USA . 2,306 parts In-Stock

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Corphita

USA . 1,499 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Futuretech Components

Singapore . 671 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Enhance your electronic designs with the DS25BR120TSDX/NOPB by Texas Instruments, a top-quality line driver that ensures reliable signal transmission. Manufactured by industry leader Texas Instruments, this device offers unparalleled performance and durability for a wide range of applications. From industrial automation to telecommunications, this product delivers exceptional value, efficiency, and precision. Upgrade your projects today with the DS25BR120TSDX/NOPB and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square packages are typically more space-efficient and easier to handle during assembly.

Maximum Transmit Delay: 0.465 ns

Provides fast signal transmission, ensuring minimal delay in communication.

Power Supplies (V): 3.3

Operates efficiently at a standard supply voltage, making it easy to integrate into existing systems.

No. of Terminals: 8

Offers multiple connection points for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact package size saves space on the PCB and allows for sleek design implementations.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature conditions without loss of performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible installation options and simplifies PCB layout.

Maximum Seated Height: 0.8 mm

Low profile design reduces overall height of the component, ideal for compact electronic devices.

Width: 3 mm

Narrow width saves space on the PCB and allows for closer placement of components.

Differential Output: YES

Differential outputs help in reducing noise and improving signal integrity in high-speed communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without damage during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints during assembly.

Length: 3 mm

Compact length contributes to the overall space-saving design of the component.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time response and accurate data transmission.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is RoHS compliant.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help in noise rejection and improve signal quality in high-speed data transmission.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent performance and compatibility with standard voltage levels.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connections on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver interface IC for efficient and reliable signal transmission in communication systems.

Technical Specifications

Line Drivers & Receivers DS25BR120TSDX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR120TSDX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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