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DS25BR120TSD/NOPB

Texas Instruments

DS25BR120TSD/NOPB by Texas Instruments

DS25BR120TSD/NOPB by Texas Instruments is a Line Driver with 3.6V max supply voltage, 0.465ns max transmit delay, and 3.3V power supplies. Ideal for industrial applications requiring differential output characteristics in a compact square package with dual terminals and very thin profile.

Median Price

$5.010

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

$2.320

100+ parts

$2.270

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$2.230

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$2.320

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Texas Instruments

USA . 67,863 parts In-Stock

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$3.481

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$2.838

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$1.892

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67,863

$3.481

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RS (Exports)

UK . 1,154 parts In-Stock

1+ parts

$3.820

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$2.840

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$2.230

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1,154

$3.820

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Farnell

UK . 5,312 parts In-Stock

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$4.300

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$2.700

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$1.970

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$4.300

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Newark

USA . 5,312 parts In-Stock

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$5.010

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$3.690

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$3.140

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$5.010

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Chip1Stop

Japan . 329 parts In-Stock

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$5.260

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$3.340

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$3.210

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$5.260

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DigiKey

USA . 5,626 parts In-Stock

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$5.280

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$3.376

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$3.032

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$2.932

5,626

$5.280

$3.376

$3.032

$2.932

Mouser Electronics

USA . 1,108 parts In-Stock

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$5.280

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$3.380

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Element14

Singapore . 5,312 parts In-Stock

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$7.550

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$5.560

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$3.980

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5,312

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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$2.838

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700

$2.838

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Digiode

USA . 2,863 parts In-Stock

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$3.307

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Vyrian

USA . 14,537 parts In-Stock

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Chip Stock

USA . 7,550 parts In-Stock

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7,550

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Sensible Micro Corp

USA . 1,950 parts In-Stock

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TME

Poland . 1,000 parts In-Stock

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$3.595

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1,000

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$3.595

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Anansix

USA . 204 parts In-Stock

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Cyclops Electronics Ltd

UK . 187 parts In-Stock

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Rebound Electronics

UK . 64 parts In-Stock

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Bristol Electronics

USA . 54 parts In-Stock

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54

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Prism Electronics

USA . 10 parts In-Stock

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10

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PC Components Company LLC

USA . 8 parts In-Stock

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8

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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8

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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8

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Elcom Components

USA . 7 parts In-Stock

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Semtec, LLC

USA . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,024 parts In-Stock

1+ parts

$2.838

100+ parts

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$2.838

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Continental Prestige Electronics

USA . 841 parts In-Stock

1+ parts

$2.838

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$2.781

841

$2.838

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$2.781

Netroflash

USA . 500 parts In-Stock

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$2.838

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$2.781

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500

$2.838

$2.781

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Semicontronic

India . 14,626 parts In-Stock

1+ parts

$2.960

100+ parts

$2.886

1k+ parts

$2.871

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14,626

$2.960

$2.886

$2.871

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Ampacity Inc.

Singapore . 14,578 parts In-Stock

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$2.960

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$2.960

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Corphita

USA . 3,487 parts In-Stock

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$3.133

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3,487

$3.133

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Parana Technologies

USA . 376 parts In-Stock

1+ parts

$4.636

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$5.110

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376

$4.636

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$5.110

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DigiPath Technology Company

USA . 844 parts In-Stock

1+ parts

$5.105

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844

$5.105

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$5.209

100+ parts

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$4.688

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742

$5.209

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$4.688

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ChromeModa Solutions

Germany . 254 parts In-Stock

1+ parts

$5.209

100+ parts

$4.271

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254

$5.209

$4.271

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Corohmni

South Africa . 164 parts In-Stock

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$7.594

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Microchip USA

USA . 2,135 parts In-Stock

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$17.734

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$17.734

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Lixinc

USA . 19,456 parts In-Stock

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Perfect Parts

USA . 11,324 parts In-Stock

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Authorized Procurement Solutions

USA . 10,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,043 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,695 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,086 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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500

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Speed Components Ltd (Excess)

Israel . 353 parts In-Stock

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353

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Metaverse IC Inc.

Canada . 326 parts In-Stock

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GreenTree Electronics

Israel . 23 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the DS25BR120TSD/NOPB line driver, designed to deliver exceptional performance in a compact square package. Ideal for a wide range of applications, this industrial-grade interface IC offers differential output, minimal transmit delay, and low power consumption. Trust in Texas Instruments to provide innovative solutions that meet your needs efficiently and effectively. Elevate your projects with the DS25BR120TSD/NOPB and experience the advantage of superior technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into PCB designs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Operating at higher supply voltages makes this product suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape offers stability and ease of mounting on the PCB.

Maximum Transmit Delay: 0.465 ns

Low transmit delay ensures efficient and fast signal transmission.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power sources.

No. of Terminals: 8

The multiple terminals provide flexibility in connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make this product suitable for compact designs with limited space.

Minimum Supply Voltage: 3 V

Operating at a minimum voltage of 3V ensures reliable operation even under lower power conditions.

Maximum High Level Input Current: 0.00001 Amp

Low input current helps in minimizing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions.

Output Characteristics: DIFFERENTIAL

The differential output provides noise immunity and improved signal integrity.

Minimum Operating Temperature: -40 °C

Operating at low temperatures makes this product suitable for applications in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations on the PCB.

Maximum Seated Height: 0.8 mm

Low seated height minimizes the overall profile of the component on the PCB.

Width: 3 mm

Compact width enables the easy placement of multiple components on the PCB.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal processing and enhances system performance.

Differential Output: YES

Differential output enhances noise immunity and signal quality in communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, this product ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability makes this product suitable for lead-free assembly processes.

Length: 3 mm

Compact length allows for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 0 ns

Zero receive delay ensures real-time signal reception and data transmission.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces potential health risks.

Maximum Supply Current: 43 mA

With a low supply current, this product consumes minimal power during operation.

Input Characteristics: DIFFERENTIAL

Differential input improves noise rejection and signal integrity in communication systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable operation within the specified range.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting of components on the PCB.

Nominal Supply Voltage-1: 3.3 V

The nominal supply voltage of 3.3V ensures consistent performance across different units.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that this product can withstand moderate exposure to moisture during storage and handling.

Interface IC Type: LINE DRIVER

The line driver interface IC type is suitable for driving high-speed data signals over long distances.

Technical Specifications

Line Drivers & Receivers DS25BR120TSD/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

43 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR120TSD/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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