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DS25BR100TSDX

Texas Instruments

DS25BR100TSDX by Texas Instruments

DS25BR100TSDX by Texas Instruments is a line driver with 3.6V max supply voltage, 0.465ns max transmit delay, and operates in -40 to 85°C range. Ideal for industrial applications requiring differential output and 3.3V nominal voltage in a small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,422 parts In-Stock

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Digiode

USA . 4,913 parts In-Stock

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Anansix

USA . 618 parts In-Stock

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618

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Distributors (Availability)

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Native Components

USA . 645 parts In-Stock

1+ parts

$0.167

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$0.160

645

$0.167

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$0.160

Northwest PG Solutions

USA . 1,911 parts In-Stock

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$0.184

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$0.162

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Parana Technologies

USA . 1,397 parts In-Stock

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$4.742

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$5.240

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1,397

$4.742

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DigiPath Technology Company

USA . 279 parts In-Stock

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$5.221

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$4.804

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279

$5.221

$4.804

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ChromeModa Solutions

Germany . 5,117 parts In-Stock

1+ parts

$5.328

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$4.369

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$5.328

$4.369

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IDEA Electronic Components Group

UK . 482 parts In-Stock

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$5.328

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$4.795

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$5.328

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AZTECH Wire

Italy . 627 parts In-Stock

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$5.950

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One Stop Electronics

USA . 535 parts In-Stock

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$20.500

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Corphita

USA . 4,773 parts In-Stock

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Overview

Experience superior performance and reliability with the DS25BR100TSDX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality in line drivers & receivers, making it the perfect choice for a wide range of applications. With a maximum supply voltage of 3.6V and differential output, this product guarantees optimal functionality and efficiency. Trust in Texas Instruments to provide you with innovative solutions that exceed your expectations and take your projects to the next level. Choose the DS25BR100TSDX for unmatched value and seamless operation.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, making it convenient for manufacturers.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, providing flexibility in various applications.

Package Shape: SQUARE

Square package shape is compact and saves space on the PCB, ideal for designs with limited space.

Maximum Transmit Delay: 0.465 ns

Low transmit delay ensures fast data transmission, suitable for high-speed communication requirements.

No. of Terminals: 8

Having multiple terminals allows for the connection of multiple components, increasing versatility.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of small outline, heat sink/slug, and very thin profile makes this product suitable for compact and space-constrained designs.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, ensuring reliability in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and corrosion resistance, ensuring a reliable connection.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a secure connection for improved reliability.

Maximum Seated Height: 0.8 mm

Low seated height allows for a more compact design, suitable for slim devices.

Width: 3 mm

Narrow width saves space on the PCB, especially useful in designs with tight constraints.

Differential Output: YES

Differential output helps in reducing noise and interference, improving signal quality.

Length: 3 mm

Compact length saves space on the PCB, contributing to a smaller overall footprint.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form provides a lead-free option, meeting environmental regulations and RoHS compliance.

Input Characteristics: DIFFERENTIAL

Differential input improves noise immunity and signal integrity, especially in high-noise environments.

Nominal Supply Voltage: 3.3 V

Close to the maximum supply voltage, ensuring optimal performance within the specified range.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact spacing between terminals, enabling a higher density of connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing processes.

Interface IC Type: LINE DRIVER

Being a line driver interface IC, it is designed for driving signals over long distances with minimal distortion, ideal for communication applications.

Technical Specifications

Line Drivers & Receivers DS25BR100TSDX attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR100TSDX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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