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DS25BR150TSDX/NOPB

Texas Instruments

DS25BR150TSDX/NOPB by Texas Instruments

DS25BR150TSDX/NOPB by Texas Instruments is a line driver with 3.3V supply, 0.465ns max transmit delay, and -40 to 85°C operating temp range. Ideal for industrial applications requiring differential output and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,695 parts In-Stock

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4,695

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Anansix

USA . 2,229 parts In-Stock

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2,229

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Vyrian

USA . 641 parts In-Stock

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641

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Distributors (Availability)

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$8.477

100+ parts

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641

$8.477

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Corohmni

South Africa . 393 parts In-Stock

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$11.080

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393

$11.080

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Parana Technologies

USA . 1,608 parts In-Stock

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$13.012

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$13.508

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1,608

$13.012

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$13.508

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$14.620

100+ parts

$13.889

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$13.158

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2,177

$14.620

$13.889

$13.158

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ChromeModa Solutions

Germany . 300 parts In-Stock

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$14.620

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$11.988

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300

$14.620

$11.988

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Ampacity Inc.

Singapore . 186 parts In-Stock

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$22.500

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186

$22.500

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One Stop Electronics

USA . 1,377 parts In-Stock

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$28.500

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$28.500

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Continental Prestige Electronics

USA . 4,072 parts In-Stock

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Argo Parts USA

USA . 2,145 parts In-Stock

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2,145

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DigiPath Technology Company

USA . 2,096 parts In-Stock

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$13.181

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$13.181

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Corphita

USA . 1,617 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Microchip USA

USA . 258 parts In-Stock

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258

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Overview

Elevate your electronic designs with the DS25BR150TSDX/NOPB by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers once again with this line driver & receiver that offers seamless communication in various applications. With its compact square package and differential output, this interface IC is a game-changer for industrial-grade projects. Say goodbye to transmission delays with a maximum transmit delay of only 0.465 ns and enjoy the peace of mind that comes with a maximum operating temperature of 85°C. Trust Texas Instruments to deliver exceptional performance and value with the DS25BR150TSDX/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in different circuit applications.

Package Shape: SQUARE

Square package shape makes it easy to handle and place on the PCB, improving overall design aesthetics.

Maximum Transmit Delay: 0.465 ns

Ultra-fast transmit delay ensures quick and efficient data transmission, ideal for high-speed communication systems.

Power Supplies (V): 3.3

Operates on a common power supply voltage, making it compatible with a wide range of systems and components.

No. of Terminals: 8

Sufficient number of terminals for connecting to other circuit components, facilitating easy integration into the overall system.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink/slub design and thin profile, enabling efficient heat dissipation and saving space on the PCB.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, conserving energy and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in harsh environments or industrial applications.

Minimum Operating Temperature: -40 °C

Operates at very low temperatures, making it suitable for applications in cold climates or freezing conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position for improved stability and better signal integrity, reducing signal interference and noise.

Maximum Seated Height: 0.8 mm

Low profile design with maximum seated height of 0.8 mm, allowing for compact and slim PCB layout.

Width: 3 mm

Narrow width of 3 mm saves space on the PCB, enabling efficient use of limited board real estate.

Differential Output: YES

Differential output for improved noise immunity and signal integrity, making it suitable for high-speed data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C for reliable and secure solder joints, meeting industry standards.

Length: 3 mm

Compact length of 3 mm, contributing to the overall small form factor and space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in demanding industrial environments or applications.

Maximum Receive Delay: 0 ns

Zero receive delay ensures immediate response to incoming signals, crucial for real-time communication systems.

Terminal Form: NO LEAD

Lead-free terminal form compliant with environmental regulations and ensuring safe handling during manufacturing and disposal.

Input Characteristics: DIFFERENTIAL

Differential input characteristics for improved noise rejection and signal fidelity, enhancing overall system performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V for consistent and reliable operation in various circuit applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm for precise connectivity and compact layout on the PCB, facilitating high-density designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicating moderate sensitivity, suitable for standard handling and reflow procedures.

Interface IC Type: LINE DRIVER

Line driver interface IC type for driving and amplifying signals over long distances, ensuring reliable communication in various applications.

Technical Specifications

Line Drivers & Receivers DS25BR150TSDX/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR150TSDX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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