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DS25BR150TSD/NOPB

Texas Instruments

DS25BR150TSD/NOPB by Texas Instruments

DS25BR150TSD/NOPB by Texas Instruments is a Line Driver with 3.6V max supply voltage, 0.465ns max transmit delay, and 85°C max operating temp. Ideal for industrial applications requiring differential output and 3.3V power supplies in a compact square package style.

Median Price

$3.418

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 83 parts In-Stock

1+ parts

$3.080

100+ parts

$2.000

1k+ parts

$1.700

10k+ parts

-

83

$3.080

$2.000

$1.700

-

Texas Instruments

USA . 35,534 parts In-Stock

1+ parts

$3.303

100+ parts

$2.693

1k+ parts

$1.795

10k+ parts

-

35,534

$3.303

$2.693

$1.795

-

Arrow

USA . 135 parts In-Stock

1+ parts

$3.533

100+ parts

$2.449

1k+ parts

-

10k+ parts

-

135

$3.533

$2.449

-

-

DigiKey

USA . 3,588 parts In-Stock

1+ parts

$5.040

100+ parts

$3.210

1k+ parts

$2.880

10k+ parts

$2.784

3,588

$5.040

$3.210

$2.880

$2.784

Mouser Electronics

USA . 17,846 parts In-Stock

1+ parts

$8.110

100+ parts

$4.880

1k+ parts

$3.500

10k+ parts

$3.350

17,846

$8.110

$4.880

$3.500

$3.350

Verical

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$2.449

1k+ parts

-

10k+ parts

-

135

-

$2.449

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$2.566

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$2.566

-

-

-

Digiode

USA . 2,791 parts In-Stock

1+ parts

$2.802

100+ parts

-

1k+ parts

-

10k+ parts

-

2,791

$2.802

-

-

-

Vyrian

USA . 10,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,534

-

-

-

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Chip Stock

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,500

-

-

-

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Anansix

USA . 2,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,559

-

-

-

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TME

Poland . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.080

10k+ parts

-

1,000

-

-

$3.080

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,864 parts In-Stock

1+ parts

$2.566

100+ parts

-

1k+ parts

-

10k+ parts

$2.515

5,864

$2.566

-

-

$2.515

Argo Parts USA

USA . 2,723 parts In-Stock

1+ parts

$2.566

100+ parts

-

1k+ parts

-

10k+ parts

-

2,723

$2.566

-

-

-

Ampacity Inc.

Singapore . 10,697 parts In-Stock

1+ parts

$2.620

100+ parts

-

1k+ parts

-

10k+ parts

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10,697

$2.620

-

-

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Corphita

USA . 4,696 parts In-Stock

1+ parts

$2.655

100+ parts

-

1k+ parts

-

10k+ parts

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4,696

$2.655

-

-

-

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$3.225

100+ parts

-

1k+ parts

-

10k+ parts

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74

$3.225

-

-

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Parana Technologies

USA . 1,531 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

$5.025

10k+ parts

-

1,531

$4.572

-

$5.025

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DigiPath Technology Company

USA . 863 parts In-Stock

1+ parts

$5.034

100+ parts

$4.632

1k+ parts

-

10k+ parts

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863

$5.034

$4.632

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-

ChromeModa Solutions

Germany . 5,660 parts In-Stock

1+ parts

$5.137

100+ parts

$4.212

1k+ parts

-

10k+ parts

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5,660

$5.137

$4.212

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IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$5.137

100+ parts

-

1k+ parts

$4.623

10k+ parts

-

1,188

$5.137

-

$4.623

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Perfect Parts

USA . 14,309 parts In-Stock

1+ parts

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100+ parts

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14,309

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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Lixinc

USA . 3,597 parts In-Stock

1+ parts

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3,597

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.515

1k+ parts

$2.438

10k+ parts

$2.386

1,000

-

$2.515

$2.438

$2.386

Overview

Enhance your electronic designs with the DS25BR150TSD/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that offer unparalleled performance and reliability. This product is perfect for applications requiring precise signal transmission with its low transmit delay and differential output characteristics. Experience the value and benefits of the DS25BR150TSD/NOPB in your projects, providing you with a seamless and efficient solution for your electronic needs. Upgrade your designs with Texas Instruments today.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing versatility and compatibility in various electronic systems.

Package Shape: SQUARE

The square package shape offers a compact and uniform design, making it easy to integrate into cramped spaces without sacrificing functionality.

Maximum Transmit Delay: 0.465 ns

The extremely low maximum transmit delay ensures fast and efficient data transmission, crucial for high-speed communication applications.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V, this product is compatible with a wide range of electronics and can be easily integrated into existing systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and interfaces, increasing the product's flexibility and usability in diverse applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of small outline, heat sink/slug, and very thin profile package style provides efficient heat dissipation, compact design, and space-saving benefits for the product.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures that the product can operate effectively even in low power scenarios, making it energy-efficient and versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in hot temperature settings.

Output Characteristics: DIFFERENTIAL

The differential output characteristics provide noise immunity, improved signal quality, and enhanced data integrity, making it ideal for demanding communication applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments, ensuring consistent performance in a wide range of temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring durable connections and long-lasting performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit board layout and connection options, allowing for customized configurations and easy installation.

Maximum Seated Height: 0.8 mm

The low maximum seated height saves space and allows for compact designs, making it suitable for applications where size constraints are critical.

Width: 3 mm

The narrow width of 3mm enables compact integration and efficient use of space on circuit boards, enhancing the overall design flexibility and versatility.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures balanced signal transmission, reduced noise interference, and improved signal quality, essential for high-performance applications.

Differential Output: YES

The presence of a differential output allows for noise rejection, improved signal integrity, and enhanced performance in high-speed communication systems, making it a reliable choice for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30s, the product offers efficient soldering processes, reducing production time and costs while ensuring consistent quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables robust solder joints and reliable connections, ensuring the product's durability and longevity in demanding environments.

Length: 3 mm

The compact length of 3mm allows for efficient use of space on circuit boards, enabling sleek and space-saving designs for various electronic applications.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this product is suitable for rugged environments and critical applications where temperature variations are common.

Maximum Receive Delay: 0 ns

The zero maximum receive delay ensures instantaneous signal processing and minimal latency, essential for high-speed communication systems that require real-time data transmission.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation process, enhances thermal performance, and reduces the risk of solder joint fractures, ensuring long-term reliability and durability.

Maximum Supply Current: 35 mA

With a maximum supply current of 35mA, the product offers low power consumption, making it energy-efficient and suitable for battery-operated devices and power-sensitive applications.

Input Characteristics: DIFFERENTIAL

The differential input characteristics provide noise immunity, signal integrity, and improved performance in noisy environments, enhancing overall reliability and compatibility with various systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and electronic components, making the product easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting, precise connections, and efficient use of space on circuit boards, enabling compact and reliable designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage and assembly, ensuring reliability and performance in humid conditions.

Interface IC Type: LINE DRIVER

As a line driver interface IC type, this product can effectively boost signal levels, drive transmission lines, and ensure robust communication in complex electronic systems, making it a reliable choice for data transmission applications.

Technical Specifications

Line Drivers & Receivers DS25BR150TSD/NOPB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.465 ns

Width:

3 mm

Trade Compliance

DS25BR150TSD/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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