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DM74LS283N

Texas Instruments

DM74LS283N by Texas Instruments

DM74LS283N by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals and a supply voltage of 5V. It operates b/w 0-70°C, making it suitable for commercial applications requiring precise calculations in a rectangular package style. Its through-hole terminal form and 2.54mm pitch offer reliability in various electronic systems.

Median Price

$1.880

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 98 parts In-Stock

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$0.870

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American Microsemiconductor Inc.

USA . 137 parts In-Stock

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TEDSS.com

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Vyrian

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ComSIT Distribution GmbH

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ECAB

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Digiode

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Pegasus Components GmbH

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Cyclops Electronics Ltd

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Bristol Electronics

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Atlantic Semiconductor

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Prism Electronics

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Electronic Expediters

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Freddi Giovanni

Italy . 370 parts In-Stock

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Standard Data Resources

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Manoshevitz Elec. Sales

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Resion

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Mentor Electronics Marketing, LLC

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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Beltway Electronics Company

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NAC Semi

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J & M Industries LLC

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Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

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Diverse Electronics

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MISTER SPROCKETS

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Native Components

USA . 712 parts In-Stock

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$0.266

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$0.255

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Northwest PG Solutions

USA . 743 parts In-Stock

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AZTECH Wire

Italy . 193 parts In-Stock

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Parana Technologies

USA . 99 parts In-Stock

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ChromeModa Solutions

Germany . 6,210 parts In-Stock

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$17.069

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IDEA Electronic Components Group

UK . 74 parts In-Stock

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$19.775

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One Stop Electronics

USA . 688 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Microchip USA

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Perfect Parts

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Supply Digital

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DigiPath Technology Company

USA . 579 parts In-Stock

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Metaverse IC Inc.

Canada . 498 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 96 parts In-Stock

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Assy Fe

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Overview

Enhance your digital arithmetic circuits with the DM74LS283N from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable performance and innovative technology in every component. This versatile device is perfect for a wide range of applications, providing customers with exceptional value and benefits. Upgrade your projects with the DM74LS283N and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with common power sources, providing easy integration into existing systems.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C allows for reliable performance in a range of environmental conditions.

Technology: TTL

The use of TTL technology offers high speed and reliability, making the product suitable for demanding arithmetic calculations.

Technical Specifications

Digital Arithmetic Circuits DM74LS283N attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM74LS283N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-110-2853, 5962011102853, 5962-01-004-1275, 5962010041275, 5962-01-287-8532, 5962012878532

NIIN

011102853, 010041275, 012878532

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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