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DM74LS174N/A+

Texas Instruments

DM74LS174N/A+ by Texas Instruments

DM74LS174N/A+ by Texas Instruments is a TTL latch with 6 functions, 36 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage of 5V and has a max frequency of 30 MHz. Ideal for applications requiring positive edge triggering in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,901 parts In-Stock

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4,901

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Vyrian

USA . 3,119 parts In-Stock

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Anansix

USA . 1,159 parts In-Stock

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Native Components

USA . 713 parts In-Stock

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$4.971

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713

$4.971

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Parana Technologies

USA . 229 parts In-Stock

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$15.044

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$15.458

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229

$15.044

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$15.458

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DigiPath Technology Company

USA . 685 parts In-Stock

1+ parts

$16.565

100+ parts

$15.240

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685

$16.565

$15.240

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ChromeModa Solutions

Germany . 3,274 parts In-Stock

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$16.903

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$13.860

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$16.903

$13.860

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

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$16.903

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$16.058

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$15.213

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1,649

$16.903

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$15.213

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AZTECH Wire

Italy . 439 parts In-Stock

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$17.958

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$17.958

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One Stop Electronics

USA . 147 parts In-Stock

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$53.000

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Corphita

USA . 5,041 parts In-Stock

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Northwest PG Solutions

USA . 654 parts In-Stock

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$4.871

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Overview

Elevate your projects with the DM74LS174N/A+ by Texas Instruments, a top-quality latch & flip-flop component designed to meet the highest standards of performance and reliability. Texas Instruments is renowned for its cutting-edge technology and innovative solutions, making this product a must-have for any electronics enthusiast. With a fast propagation delay, versatile trigger type, and wide operating temperature range, this component offers unmatched value and versatility. Whether you're working on robotics, industrial controls, or consumer electronics, the DM74LS174N/A+ is the perfect choice to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the latch or flip-flop easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 36 ns

Low propagation delay ensures fast switching between states, making this latch or flip-flop suitable for high-speed applications.

No. of Functions: 6

Having 6 functions in one component offers versatility and functionality for complex circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used voltage level, ensuring compatibility with most electronic systems.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of the latch or flip-flop with external signals.

Maximum Frequency At Nominal Supply: 30000000 Hz

High maximum frequency capability makes this latch or flip-flop suitable for high-speed digital applications.

Technology: TTL

TTL technology provides reliable and robust logic levels, ensuring stable operation in a variety of environments.

Technical Specifications

Latches & Flip-Flops DM74LS174N/A+ attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

26 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

36 ns

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Minimum fmax:

25 MHz

Trade Compliance

DM74LS174N/A+ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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