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DM74LS259N

Texas Instruments

DM74LS259N by Texas Instruments

DM74LS259N by Texas Instruments is a TTL latch with 16 terminals and a supply voltage of 5V. It has a propagation delay of 38ns, operates b/w 0-70°C, and features low-level triggering. This rectangular package is commonly used in commercial applications for data storage and signal processing.

Median Price

$1.011

Lifecycle Status

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Component Electronics Inc.

Canada . 54 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Mil-Aero Solutions, Inc.

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ABC Electronics Ltd.

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Mentor Electronics Marketing, LLC

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One Stop Electronics

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Northwest PG Solutions

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Parana Technologies

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DigiPath Technology Company

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Overview

Elevate your electronic projects with the DM74LS259N latch & flip-flop from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a versatile component that is perfect for a wide range of applications. Whether you're working on industrial automation, consumer electronics, or communication systems, this product offers fast propagation delay and low trigger level for seamless operation. Trust in Texas Instruments to deliver superior performance and efficiency, ensuring that your projects run smoothly every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental conditions, making this latch flip-flop suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most electronic systems, simplifying integration.

Propagation Delay (tpd): 38 ns

With a fast propagation delay of 38ns, this latch flip-flop allows for quick response times in applications requiring high-speed data processing.

Trigger Type: LOW LEVEL

The low-level trigger type ensures reliable and stable operation, making this latch flip-flop suitable for sensitive electronic circuits.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this latch flip-flop is suitable for use in standard environments without the need for additional cooling or temperature regulation.

Technical Specifications

Latches & Flip-Flops DM74LS259N attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

38 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

DM74LS259N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-247-1922, 5962012471922, 5962-01-287-8534, 5962012878534

NIIN

012471922, 012878534

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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