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DM74LS109AN

Texas Instruments

DM74LS109AN by Texas Instruments

DM74LS109AN by Texas Instruments is a TTL technology latch with 2 bits, 35 ns propagation delay, and 5V nominal voltage. It is used in applications requiring positive edge trigger type latches & flip-flops with complementary output polarity. The package style is in-line with 16 terminals and a max frequency of 20 MHz at nominal supply.

Median Price

$1.400

Lifecycle Status

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33

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Overview

Enhance your electronic projects with the DM74LS109AN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops like this one, perfect for various applications. With a nominal supply voltage of 5V and a fast propagation delay of 35ns, this product offers exceptional performance and reliability. Upgrade your designs with the DM74LS109AN and experience the value, benefits, and advantages it brings to your projects. Trust Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the latches & flip-flops, making them suitable for a variety of applications.

Propagation Delay At Nominal Supply: 35 ns

Fast propagation delay ensures quick response times in switching circuits.

No. of Functions: 2

Capability to perform two functions in a single device, offering versatility and efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs.

No. of Bits: 2

Provides a 2-bit output for more complex logic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with many systems.

Load Capacitance (CL): 50 pF

Can handle a load capacitance of 50 pF, ensuring stable performance in various configurations.

Power Supplies (V): 5

Consistently operates at a 5V supply voltage for reliable performance.

No. of Terminals: 16

Offers multiple terminals for easy connections and integration into circuits.

Package Style (Meter): IN-LINE

In-line package style allows for easy mounting on circuit boards.

Maximum I (ol): 8 Amp

Can handle a maximum output current of 8A, ensuring compatibility with various load requirements.

Propagation Delay (tpd): 35 ns

Fast propagation delay ensures quick response times in switching circuits.

Maximum Operating Temperature: 70 °C

Can operate in a wide temperature range, suitable for different environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger type allows for precise control of the latch & flip-flop operations.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without issue.

Terminal Position: DUAL

Dual terminal position for enhanced connectivity and flexibility in circuit designs.

Maximum Seated Height: 5.08 mm

Low profile design with a maximum seated height of 5.08mm for space-saving installations.

Width: 7.62 mm

Compact width allows for efficient use of space on circuit boards.

Output Polarity: COMPLEMENTARY

Complementary output polarity for more versatile logic operations.

Minimum Supply Voltage (Vsup): 4.75 V

Can operate at a minimum supply voltage of 4.75V for flexibility in power supply options.

Length: 19.305 mm

Optimal length for easy integration into circuit board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard operating conditions.

Maximum Frequency At Nominal Supply: 20000000 Hz

High maximum frequency capability for fast data processing.

Technology: TTL

Utilizes TTL technology for reliable and consistent performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and durable connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy integration into circuit designs.

Minimum fmax: 25 MHz

Minimum fmax of 25MHz for fast data processing and signal transmission.

Maximum Supply Voltage (Vsup): 5.25 V

Can handle a maximum supply voltage of 5.25V for added protection against voltage fluctuations.

Maximum Power Supply Current (ICC): 8 mA

Maximum power supply current of 8mA for efficient power management.

Technical Specifications

Latches & Flip-Flops DM74LS109AN attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

8 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

DM74LS109AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-166-9374, 5962011669374

NIIN

011669374

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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