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DM74LS259M

Texas Instruments

DM74LS259M by Texas Instruments

The Texas Instruments DM74LS259M is a TTL latch with 16 terminals and a supply voltage range of 4.75V to 5.25V. It has a propagation delay of 38ns, operates b/w 0°C to 70°C, and features low-level triggering. This small outline package is ideal for applications requiring true output polarity in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,697 parts In-Stock

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Digiode

USA . 3,305 parts In-Stock

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Anansix

USA . 2,006 parts In-Stock

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2,006

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Semi Source

USA . 48 parts In-Stock

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48

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Native Components

USA . 659 parts In-Stock

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$0.088

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$0.085

659

$0.088

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$0.085

Northwest PG Solutions

USA . 1,711 parts In-Stock

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$0.097

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$0.086

1,711

$0.097

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$0.086

AZTECH Wire

Italy . 780 parts In-Stock

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$7.602

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780

$7.602

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Parana Technologies

USA . 1,535 parts In-Stock

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$16.799

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$17.046

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1,535

$16.799

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$17.046

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DigiPath Technology Company

USA . 1,270 parts In-Stock

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$18.498

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$17.018

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$18.498

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ChromeModa Solutions

Germany . 1,802 parts In-Stock

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$18.875

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$15.478

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$18.875

$15.478

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IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$18.875

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$17.931

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$16.988

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387

$18.875

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One Stop Electronics

USA . 966 parts In-Stock

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$32.000

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Corphita

USA . 4,616 parts In-Stock

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Supply Digital

USA . 2,778 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality DM74LS259M latch and flip-flop by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers reliable components that are essential for a wide range of applications in the electronics industry. The DM74LS259M offers customers exceptional value with its fast propagation delay, low trigger type, and true output polarity. Whether you're working on digital circuits, memory units, or data storage systems, this versatile component will streamline your designs and enhance overall performance. Trust Texas Instruments for top-notch products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that protects the internal components of the latch or flip-flop.

Surface Mount: YES

Allows for easy installation on circuit boards.

Nominal Supply Voltage (Vsup): 5V

Standard voltage level for compatibility with many electronic systems.

Propagation Delay (tpd): 38 ns

Fast signal processing for efficient operation.

Maximum Operating Temperature: 70°C

Can withstand high temperature environments without malfunctioning.

Trigger Type: LOW LEVEL

Responds to low input signals for precise triggering.

Technology: TTL

Uses transistor-transistor logic for reliable performance.

Technical Specifications

Latches & Flip-Flops DM74LS259M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

9.902 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

38 ns

Maximum Seated Height:

1.753 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

DM74LS259M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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