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CY74FCT273CTSOCTG4

Texas Instruments

CY74FCT273CTSOCTG4 by Texas Instruments

CY74FCT273CTSOCTG4 by Texas Instruments is an 8-bit latch with a propagation delay of 5.8 ns at 5V, suitable for industrial applications. It features positive edge triggering, operates b/w -40 to 85°C, and has a max frequency of 83.3 MHz. This surface-mount flip-flop has a small outline package with Gull Wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,565 parts In-Stock

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Vyrian

USA . 3,260 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 968 parts In-Stock

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$6.063

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$6.063

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Parana Technologies

USA . 1,848 parts In-Stock

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$12.594

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$1,169.498

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$11.334

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DigiPath Technology Company

USA . 1,138 parts In-Stock

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$13.867

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ChromeModa Solutions

Germany . 6,844 parts In-Stock

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$14.150

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$11.603

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IDEA Electronic Components Group

UK . 218 parts In-Stock

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$14.150

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$13.442

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$12.735

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218

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AZTECH Wire

Italy . 345 parts In-Stock

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$15.615

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One Stop Electronics

USA . 932 parts In-Stock

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Corphita

USA . 1,789 parts In-Stock

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Northwest PG Solutions

USA . 804 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of your electronic designs with the CY74FCT273CTSOCTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their latches & flip-flops. Ideal for a wide range of applications, this product offers a fast propagation delay and low power consumption. With its compact package style and dual terminal position, the CY74FCT273CTSOCTG4 provides value, efficiency, and performance to customers looking to elevate their projects to the next level. Choose Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the latch or flip-flop, making it suitable for various industrial applications.

Propagation Delay At Nominal Supply: 5.8 ns

The low propagation delay of 5.8 ns ensures fast response time, making this latch or flip-flop ideal for high-speed applications where quick signal processing is required.

Surface Mount: YES

The surface mount compatibility allows for easy and efficient installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate this latch or flip-flop into existing circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions, making this latch or flip-flop suitable for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Latches & Flip-Flops CY74FCT273CTSOCTG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

83300000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT273CTSOCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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