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CY74FCT273CTQCTE4

Texas Instruments

CY74FCT273CTQCTE4 by Texas Instruments

CY74FCT273CTQCTE4 by Texas Instruments is an 8-bit latches & flip-flops IC with a propagation delay of 5.8 ns at 5V, suitable for industrial applications. It features a max frequency of 83.3 MHz, operates b/w -40°C to 85°C, and has a small outline package style for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,601 parts In-Stock

1+ parts

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4,601

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Digiode

USA . 4,463 parts In-Stock

1+ parts

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4,463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 101 parts In-Stock

1+ parts

$0.118

100+ parts

-

1k+ parts

-

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$0.113

101

$0.118

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-

$0.113

Northwest PG Solutions

USA . 2,349 parts In-Stock

1+ parts

$0.130

100+ parts

-

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-

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$0.114

2,349

$0.130

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$0.114

One Stop Electronics

USA . 475 parts In-Stock

1+ parts

$14.000

100+ parts

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475

$14.000

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AZTECH Wire

Italy . 370 parts In-Stock

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$16.986

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370

$16.986

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Parana Technologies

USA . 185 parts In-Stock

1+ parts

$22.908

100+ parts

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$23.569

10k+ parts

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185

$22.908

-

$23.569

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DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$25.224

100+ parts

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2,061

$25.224

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ChromeModa Solutions

Germany . 6,065 parts In-Stock

1+ parts

$25.739

100+ parts

$21.106

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6,065

$25.739

$21.106

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IDEA Electronic Components Group

UK . 577 parts In-Stock

1+ parts

$25.739

100+ parts

$24.452

1k+ parts

$23.165

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577

$25.739

$24.452

$23.165

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Corphita

USA . 1,990 parts In-Stock

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1,990

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Overview

Elevate your electronic projects with the CY74FCT273CTQCTE4 by Texas Instruments, a top-of-the-line latches & flip-flops component that promises unparalleled quality and reliability. Manufactured by industry giant Texas Instruments, this product boasts a wide range of applications, making it a must-have for any electronics enthusiast. With its quick propagation delay and true output polarity, this versatile component ensures seamless performance in a variety of settings. Trust Texas Instruments to deliver cutting-edge technology that brings value, benefits, and advantages to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and reliability, making this latch & flip-flop suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 5.8 ns

The low propagation delay ensures quick response time, making it ideal for high-speed applications where timing is critical.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 8

With 8 bits, this latch & flip-flop can handle complex data processing tasks and provide greater flexibility in control applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, ensuring compatibility with most electronic systems and reducing the need for additional components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this latch & flip-flop can withstand harsh environmental conditions and maintain stable performance in industrial settings.

Technical Specifications

Latches & Flip-Flops CY74FCT273CTQCTE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

83300000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

CY74FCT273CTQCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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