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CY74FCT273CTSOCE4

Texas Instruments

CY74FCT273CTSOCE4 by Texas Instruments

CY74FCT273CTSOCE4 by Texas Instruments is an 8-bit latch with a propagation delay of 5.8 ns at 5V, suitable for industrial applications. It features positive edge triggering, CMOS technology, and a max frequency of 83.3 MHz, making it ideal for high-speed data storage and transfer in electronic systems.

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1k+

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Digiode

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Vyrian

USA . 2,392 parts In-Stock

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AZTECH Wire

Italy . 248 parts In-Stock

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Parana Technologies

USA . 285 parts In-Stock

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$10.314

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DigiPath Technology Company

USA . 620 parts In-Stock

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$10.719

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$9.862

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ChromeModa Solutions

Germany . 3,334 parts In-Stock

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IDEA Electronic Components Group

UK . 2,279 parts In-Stock

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$10.391

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$9.844

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One Stop Electronics

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Northwest PG Solutions

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Overview

Experience unmatched quality and reliability with the CY74FCT273CTSOCE4 by Texas Instruments, a leading manufacturer in the industry. This latches & flip-flops category product offers exceptional performance in various applications. With a nominal supply voltage of 5V and a propagation delay of just 5.8ns, this small outline package is perfect for industrial use. Trust in the advanced technology of Texas Instruments and elevate your projects to new heights with the CY74FCT273CTSOCE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 5.8 ns

Low propagation delay leads to fast operation and efficient performance.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards.

No. of Bits: 8

Suitable for applications requiring processing of 8-bit data.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, compatible with many systems.

Load Capacitance (CL): 50 pF

Works efficiently with a load capacitance of 50 pF.

Power Supplies (V): 5

Consistent power supply of 5V for stable performance.

No. of Terminals: 20

Sufficient terminals for connecting the latch or flip-flop to other components.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space and allows for dense circuit layouts.

Maximum I (ol): 64 Amp

High output current capability of 64A for driving external loads.

Trigger Type: POSITIVE EDGE

Positive edge triggering for precise control and timing of operations.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C ensures functionality in various environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C for reliability in industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures reliable terminal connections for improved signal transmission.

Maximum Frequency At Nominal Supply: 83300000 Hz

Capable of operating at a high frequency of 83.3 MHz for faster processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure attachment to the circuit board.

Packing Method: TUBE

Easy handling and storage with tube packing method.

Technical Specifications

Latches & Flip-Flops CY74FCT273CTSOCE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

83300000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT273CTSOCE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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