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CY74FCT2374ATSOCTE4

Texas Instruments

CY74FCT2374ATSOCTE4 by Texas Instruments

CY74FCT2374ATSOCTE4 by Texas Instruments is a latches & flip-flops IC with 8 functions and 20 terminals. It operates at a nominal voltage of 5V, has a propagation delay of 6.5ns, and features a max operating temperature of 85°C. Ideal for industrial applications requiring positive edge triggering and 3-state output characteristics.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,274 parts In-Stock

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Digiode

USA . 4,341 parts In-Stock

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Native Components

USA . 897 parts In-Stock

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$1.380

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Northwest PG Solutions

USA . 795 parts In-Stock

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$1.518

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AZTECH Wire

Italy . 208 parts In-Stock

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$14.176

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Parana Technologies

USA . 1,402 parts In-Stock

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$26.732

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$27.910

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DigiPath Technology Company

USA . 104 parts In-Stock

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$29.435

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$27.080

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One Stop Electronics

USA . 1,192 parts In-Stock

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$30.000

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ChromeModa Solutions

Germany . 5,455 parts In-Stock

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$24.630

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IDEA Electronic Components Group

UK . 520 parts In-Stock

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$30.036

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$28.534

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$27.032

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Corphita

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Overview

Enhance your electronic projects with the CY74FCT2374ATSOCTE4 from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This versatile latch & flip-flop offers speedy 6.5 ns propagation delay, making it ideal for applications requiring fast signal processing. Its 3-STATE output characteristics and positive edge trigger type provide added flexibility. With 8 functions in one small outline package, this product is a cost-effective solution that maximizes performance while minimizing space requirements. Upgrade your designs today with the CY74FCT2374ATSOCTE4 and experience the difference Texas Instruments quality can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to shocks, making the latch more reliable and long-lasting.

Propagation Delay At Nominal Supply: 6.5 ns

High-speed operation ensures quick response times and efficient performance.

Surface Mount: YES

Easily mountable on PCBs, saving space and facilitating assembly.

No. of Functions: 8

Offers versatile functionality and capability to handle multiple operations simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Suitable for driving a variety of loads efficiently without compromising performance.

Power Supplies (V): 5

Optimized for use with 5V power supplies, ensuring reliable and consistent operation.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and peripherals, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and enables efficient layout for better integration.

Maximum I (ol): 12 Amp

Allows for driving high-current loads with ease, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, increasing its suitability for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, reducing power consumption and improving efficiency.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise timing and coordination with other components in the system.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature conditions, making it suitable for use in a wide range of environments.

Terminal Position: DUAL

Dual terminal position allows for flexible installation options, accommodating different PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and robust mechanical connections for improved durability.

Packing Method: TR

TR packing method ensures convenient handling and storage during distribution and assembly processes.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with commonly used connectors and sockets.

Technical Specifications

Latches & Flip-Flops CY74FCT2374ATSOCTE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

6.5 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

CY74FCT2374ATSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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