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CY74FCT2374CTSOCTE4

Texas Instruments

CY74FCT2374CTSOCTE4 by Texas Instruments

CY74FCT2374CTSOCTE4 by Texas Instruments is an 8-function latches & flip-flops IC with a propagation delay of 5.2ns at 5V, suitable for industrial applications. It features a max operating temperature of 85°C, positive edge trigger type, and 3-STATE output characteristics. This CMOS technology device comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,281 parts In-Stock

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Digiode

USA . 1,424 parts In-Stock

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Native Components

USA . 191 parts In-Stock

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$0.094

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$0.090

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Northwest PG Solutions

USA . 984 parts In-Stock

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$0.103

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$0.091

984

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AZTECH Wire

Italy . 668 parts In-Stock

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$5.309

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Parana Technologies

USA . 2,177 parts In-Stock

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$26.657

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$2,475.533

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$23.992

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DigiPath Technology Company

USA . 1,928 parts In-Stock

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$29.353

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IDEA Electronic Components Group

UK . 1,299 parts In-Stock

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$29.952

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$28.454

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$26.957

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ChromeModa Solutions

Germany . 701 parts In-Stock

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$29.952

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$24.561

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One Stop Electronics

USA . 1,388 parts In-Stock

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Corphita

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Overview

Unlock a world of possibilities with the CY74FCT2374CTSOCTE4 by Texas Instruments. This high-quality latch & flip-flop device offers unmatched reliability and performance, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile product delivers value, benefits, and advantages that customers can count on. Experience the Texas Instruments difference and take your projects to the next level with the CY74FCT2374CTSOCTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the latch or flip-flop suitable for long-term use.

Propagation Delay At Nominal Supply: 5.2 ns

Fast propagation delay ensures quick response time, which is crucial in applications requiring high-speed operation.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

No. of Functions: 8

The latch or flip-flop offers 8 different functions, providing versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50pF, the latch or flip-flop can drive external loads effectively without signal degradation.

Power Supplies (V): 5

The product operates efficiently at a 5V power supply, ensuring optimal performance and reliability.

No. of Terminals: 20

Having 20 terminals provides ample connection options, facilitating complex circuit integration and customization.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact and densely populated circuits.

Maximum I (ol): 12 Amp

High maximum output current of 12A allows the latch or flip-flop to drive heavy loads without overheating or performance issues.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand elevated temperatures in industrial environments.

Output Characteristics: 3-STATE

3-state output allows the latch or flip-flop to disconnect from the output line, enabling tri-state bus capability for efficient data transmission.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures reliable and consistent data capture on the rising edge of the clock signal, enhancing signal integrity.

Minimum Operating Temperature: -40 °C

Operates reliably at low temperatures down to -40°C, making it suitable for outdoor or harsh environment applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting orientation and connection options, accommodating various design requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, providing long-term durability.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mount assembly and provides secure solder connections for enhanced reliability.

Packing Method: TR

TR packing method offers convenient tape and reel packaging for automated assembly, increasing efficiency and reducing handling errors.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm enables easy and accurate soldering onto PCBs, ensuring secure and reliable connections.

Technical Specifications

Latches & Flip-Flops CY74FCT2374CTSOCTE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

8

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

CY74FCT2374CTSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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