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CLC109AJM5

Texas Instruments

CLC109AJM5 by Texas Instruments

The Texas Instruments CLC109AJM5 is a buffer amplifier with a 270 MHz bandwidth, 220 V/us slew rate, and 8200 uV max input offset voltage. Ideal for industrial applications requiring high-speed signal buffering in compact designs due to its small outline package and low profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,832 parts In-Stock

1+ parts

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4,832

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Anansix

USA . 2,200 parts In-Stock

1+ parts

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2,200

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Digiode

USA . 1,875 parts In-Stock

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1,875

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 393 parts In-Stock

1+ parts

$2.417

100+ parts

-

1k+ parts

$2.915

10k+ parts

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393

$2.417

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$2.915

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DigiPath Technology Company

USA . 2,214 parts In-Stock

1+ parts

$2.662

100+ parts

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2,214

$2.662

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ChromeModa Solutions

Germany . 5,379 parts In-Stock

1+ parts

$2.716

100+ parts

$2.227

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5,379

$2.716

$2.227

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IDEA Electronic Components Group

UK . 2,056 parts In-Stock

1+ parts

$2.716

100+ parts

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$2.444

10k+ parts

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2,056

$2.716

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$2.444

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One Stop Electronics

USA . 592 parts In-Stock

1+ parts

$8.410

100+ parts

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592

$8.410

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$18.275

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254

$18.275

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Corphita

USA . 2,881 parts In-Stock

1+ parts

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2,881

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Northwest PG Solutions

USA . 1,224 parts In-Stock

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1,224

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Native Components

USA . 195 parts In-Stock

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195

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Overview

Elevate your electronic designs with the CLC109AJM5 by Texas Instruments, a top-quality buffer amplifier that delivers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this compact and versatile device is perfect for a wide range of applications. From precision signal conditioning to signal buffering, this amplifier offers exceptional value and benefits to customers seeking high-speed operation and low power consumption. Trust Texas Instruments for cutting-edge technology that sets the standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Input Offset Voltage: 8200 uV

Having a high maximum input offset voltage allows for accurate signal processing and reduces errors in the output signal.

Maximum Average Bias Current (IIB): 8 uA

Low bias current ensures minimal power consumption and helps maintain signal integrity.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact designs and circuit boards.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and power sources.

Power Supplies (V): +-5

The dual power supply capability allows flexibility in powering the device and enables consistent performance in varying conditions.

No. of Terminals: 5

Having a moderate number of terminals simplifies the connection process and improves overall usability.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The compact and slim design of the package saves space and is ideal for applications where size constraints are a concern.

Minimum Slew Rate: 220 V/us

A high minimum slew rate ensures rapid signal processing and response time, making the product suitable for high-speed applications.

Maximum Supply Voltage Limit: 7 V

The maximum supply voltage limit provides overvoltage protection and safeguards the device from potential damage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to operate in extreme cold environments, making it versatile for various applications.

Terminal Finish: TIN LEAD

The tin lead finish provides excellent conductivity and solderability, ensuring secure connections and reliable performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexible wiring configurations and compatibility with different circuit layouts.

Maximum Seated Height: 1.42 mm

The low seated height makes the product suitable for compact designs and applications where space is limited.

Width: 1.65 mm

The narrow width of the product further enhances its suitability for compact installations and space-constrained environments.

Nominal Bandwidth (3dB): 270 MHz

A high nominal bandwidth ensures excellent signal transmission and allows for processing high-frequency signals with accuracy.

Length: 2.92 mm

The short length of the product contributes to its compact design and makes it easy to incorporate into tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature conditions.

Maximum Negative Supply Voltage Limit: -7 V

The negative supply voltage limit provides protection against overvoltage situations and helps maintain the integrity of the device.

Technology: BIPOLAR

Bipolar technology offers high precision and stability in signal processing, making the product suitable for critical applications where accuracy is essential.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures secure connections, enhancing the overall reliability of the product.

Amplifier Type: BUFFER

Being a buffer amplifier, the product helps maintain signal integrity, provides impedance matching, and minimizes signal distortion, making it an ideal choice for signal processing applications.

Maximum Supply Current: 4 mA

The low maximum supply current helps conserve power and ensures energy-efficient operation, making the product suitable for battery-powered devices.

Nominal Negative Supply Voltage (Vsup): -5 V

The nominal negative supply voltage allows for operation with a dual power supply and provides flexibility in powering the device.

Nominal Slow Rate: 350 V/us

A high nominal slew rate ensures rapid signal response and high-speed signal processing, making the product suitable for high-frequency applications.

Terminal Pitch: 0.95 mm

With a small terminal pitch, the product is suitable for compact designs and allows for efficient use of space on circuit boards.

Minimum Output Current: 0.04 A

The minimum output current capability ensures compatibility with a wide range of loads and applications, making the product versatile in its use.

Technical Specifications

Buffer Amplifiers CLC109AJM5 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

270 MHz

Minimum Slew Rate:

220 V/us

Nominal Slew Rate:

350 V/us

Input Offset Voltage Limit:

8.2 mV

Peak Bias Current:

8 uA

Maximum Bias Current (IIB) @25 °C:

4 uA

Operational Characteristics

Maximum Supply Current:

4 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-7 V

Lowest Output Current:

40 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.115 in (2.92 mm)

Width:

0.065 in (1.65 mm)

Maximum Seated Height:

0.056 in (1.42 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

CLC109AJM5 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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