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CLC115AJP

Texas Instruments

CLC115AJP by Texas Instruments

The Texas Instruments CLC115AJP is a buffer amplifier with 4 functions, 700 MHz bandwidth, and 2200 V/us slew rate. It operates in industrial temperatures from -40 to 85 °C and has a max supply voltage of 7V. Ideal for applications requiring high-speed signal buffering in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,322 parts In-Stock

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Anansix

USA . 2,296 parts In-Stock

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Digiode

USA . 2,035 parts In-Stock

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Electronics Depot

USA . 23 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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One Stop Electronics

USA . 276 parts In-Stock

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$3.410

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Parana Technologies

USA . 1,620 parts In-Stock

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$3.768

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$4.262

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ChromeModa Solutions

Germany . 5,176 parts In-Stock

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$4.234

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$3.472

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IDEA Electronic Components Group

UK . 760 parts In-Stock

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$4.234

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$3.811

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AZTECH Wire

Italy . 318 parts In-Stock

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$8.601

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Corphita

USA . 4,557 parts In-Stock

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DigiPath Technology Company

USA . 1,280 parts In-Stock

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Native Components

USA . 642 parts In-Stock

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Northwest PG Solutions

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Overview

Elevate your electronic designs with the top-quality CLC115AJP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched precision and reliability in their buffer amplifiers. Ideal for a wide range of applications, this versatile product offers customers exceptional value, benefits, and advantages. Experience seamless performance and enhanced functionality with the CLC115AJP, setting new standards for excellence in the field of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for portable electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Suitable voltage supply for a wide range of electronic applications.

Nominal Bandwidth (3dB): 700 MHz

High bandwidth allows for fast signal processing and low distortion.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Technical Specifications

Buffer Amplifiers CLC115AJP attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

4

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

700 MHz

Minimum Slew Rate:

2200 V/us

Nominal Slew Rate:

2700 V/us

Peak Bias Current:

20 uA

Maximum Bias Current (IIB) @25 °C:

20 uA

Operational Characteristics

Maximum Supply Current:

61 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-7 V

Lowest Output Current:

48 A

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.72 in (18.288 mm)

Width:

0.3 in (7.62 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

CLC115AJP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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