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CLC110AJP

Texas Instruments

CLC110AJP by Texas Instruments

The Texas Instruments CLC110AJP is a buffer amplifier with 90 MHz bandwidth, 8000 uV max input offset voltage, and 50 uA max average bias current. Ideal for industrial applications requiring high-speed signal buffering in a compact package with -40 to 85 °C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,098 parts In-Stock

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Digiode

USA . 2,097 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 89 parts In-Stock

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89

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Anansix

USA . 72 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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J & M Industries LLC

USA . 3 parts In-Stock

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Microfarads

USA . 1 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 630 parts In-Stock

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$0.039

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$0.037

630

$0.039

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$0.037

Parana Technologies

USA . 521 parts In-Stock

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$3.902

100+ parts

$362.338

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$3.512

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521

$3.902

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$3.512

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DigiPath Technology Company

USA . 216 parts In-Stock

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$4.296

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$4.296

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ChromeModa Solutions

Germany . 5,379 parts In-Stock

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$4.384

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$3.595

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IDEA Electronic Components Group

UK . 896 parts In-Stock

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$4.384

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$3.946

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One Stop Electronics

USA . 1,336 parts In-Stock

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$4.410

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AZTECH Wire

Italy . 436 parts In-Stock

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$13.701

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Northwest PG Solutions

USA . 1,362 parts In-Stock

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Corphita

USA . 1,254 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CLC110AJP by Texas Instruments. Known for their top-quality products, Texas Instruments delivers buffer amplifiers like no other. With a wide range of applications in various industries, this amplifier offers unmatched value and benefits to customers. Improve the efficiency and reliability of your systems with the CLC110AJP, providing high-quality signal buffering and amplification. Trust Texas Instruments to provide you with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the buffer amplifier easy to handle and resistant to damage.

Maximum Input Offset Voltage: 8000 uV

Having a high maximum input offset voltage allows for precise signal amplification with minimal distortion.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and applications.

Minimum Slew Rate: 500 V/us

The high minimum slew rate of 500 V/us enables the buffer amplifier to respond quickly to fast-changing input signals.

Nominal Bandwidth (3dB): 90 MHz

With a high nominal bandwidth of 90 MHz, this buffer amplifier can handle high-frequency signals effectively.

Technology: BIPOLAR

The bipolar technology used in this buffer amplifier provides high precision and low noise performance for accurate signal amplification.

Technical Specifications

Buffer Amplifiers CLC110AJP attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

90 MHz

Minimum Slew Rate:

500 V/us

Nominal Slew Rate:

800 V/us

Input Offset Voltage Limit:

8 mV

Peak Bias Current:

50 uA

Maximum Bias Current (IIB) @25 °C:

50 uA

Operational Characteristics

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-7 V

Lowest Output Current:

50 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.386 in (9.817 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Tin/Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In-Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

CLC110AJP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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