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THS7327PHPRG4

Texas Instruments

THS7327PHPRG4 by Texas Instruments

THS7327PHPRG4 by Texas Instruments is a 48-terminal buffer amplifier with a bandwidth of 500 MHz, ideal for industrial applications. It operates b/w -40 to 85 °C and has a max supply voltage of 5.5 V, making it suitable for high-speed signal processing in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,093 parts In-Stock

1+ parts

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3,093

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Digiode

USA . 1,805 parts In-Stock

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1,805

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,441 parts In-Stock

1+ parts

$4.039

100+ parts

-

1k+ parts

$4.501

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1,441

$4.039

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$4.501

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One Stop Electronics

USA . 1,115 parts In-Stock

1+ parts

$4.410

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-

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$4.410

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DigiPath Technology Company

USA . 1,385 parts In-Stock

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$4.447

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1,385

$4.447

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ChromeModa Solutions

Germany . 6,889 parts In-Stock

1+ parts

$4.538

100+ parts

$3.721

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6,889

$4.538

$3.721

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IDEA Electronic Components Group

UK . 306 parts In-Stock

1+ parts

$4.538

100+ parts

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$4.084

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306

$4.538

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$4.084

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$10.671

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233

$10.671

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Corphita

USA . 3,337 parts In-Stock

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Microchip USA

USA . 1,340 parts In-Stock

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Overview

Enhance your electronic designs with the THS7327PHPRG4 by Texas Instruments, a top-quality buffer amplifier that delivers exceptional performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this buffer amplifier is perfect for a wide range of applications. With a nominal bandwidth of 500 MHz and a maximum supply voltage limit of 5.5V, this product offers unmatched value and benefits to customers seeking high-quality amplification solutions. Upgrade your projects today with the THS7327PHPRG4 and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the buffer amplifier, ensuring long-term reliability.

Maximum Average Bias Current (IIB): 3.5 uA

Low bias current helps in minimizing power consumption and maintaining stability in the circuit.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enabling efficient assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many electronic systems, making this buffer amplifier compatible with a wide range of applications.

Nominal Bandwidth (3dB): 500 MHz

High bandwidth of 500 MHz ensures that the buffer amplifier can accurately amplify high-frequency signals, making it suitable for demanding applications.

Maximum Seated Height: 1.2 mm

Low seated height helps in achieving a compact design and facilitates integration in space-constrained environments.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance across a wide temperature range, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the buffer amplifier energy-efficient and reliable.

Minimum Output Current: 0.045 A

The minimum output current of 0.045 A ensures that the buffer amplifier can deliver sufficient current to drive connected loads effectively.

Technical Specifications

Buffer Amplifiers THS7327PHPRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

500 MHz

Nominal Slew Rate:

1050 V/us

Peak Bias Current:

3.5 uA

Operational Characteristics

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

5.5 V

Lowest Output Current:

45 mA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.276 in (7 mm)

Width:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

48

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Trade Compliance

THS7327PHPRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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