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THS7314DRG4

Texas Instruments

THS7314DRG4 by Texas Instruments

THS7314DRG4 by Texas Instruments is a Buffer Amplifier with 3 functions, operating at 3.3V/5V. It has a bandwidth of 10.6MHz and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring small outline packages and surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 283,862 parts In-Stock

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Vyrian

USA . 5,516 parts In-Stock

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5,516

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Digiode

USA . 1,527 parts In-Stock

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1,527

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,093 parts In-Stock

1+ parts

$3.410

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1,093

$3.410

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Parana Technologies

USA . 2,373 parts In-Stock

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$5.569

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$6.353

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2,373

$5.569

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$6.353

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DigiPath Technology Company

USA . 199 parts In-Stock

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$6.132

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199

$6.132

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$6.257

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$5.631

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2,317

$6.257

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$5.631

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ChromeModa Solutions

Germany . 286 parts In-Stock

1+ parts

$6.257

100+ parts

$5.131

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286

$6.257

$5.131

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AZTECH Wire

Italy . 278 parts In-Stock

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$15.205

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278

$15.205

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A-Z Elektronik GmbH

Germany . 6,489 parts In-Stock

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6,489

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kepictronics

USA . 2,800 parts In-Stock

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2,800

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Corphita

USA . 1,970 parts In-Stock

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Overview

Enhance your electronic designs with the THS7314DRG4 by Texas Instruments, a top-quality buffer amplifier that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this versatile component is ideal for a wide range of applications. With a compact design and advanced technology, it provides customers with unmatched value, benefits, and advantages. Elevate your projects with the THS7314DRG4 and experience enhanced functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V allows for compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and extended usage.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Buffer Amplifiers THS7314DRG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

3.3/5 V

Total Functions:

3

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

10.6 MHz

Operational Characteristics

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage:

5.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

THS7314DRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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