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CDCVF857DGG

Texas Instruments

CDCVF857DGG by Texas Instruments

The Texas Instruments CDCVF857DGG is a clock driver with 48 terminals, operating at 2.5V and offering a propagation delay of 3.5ns. It features differential input conditioning, 10 true outputs, and a max frequency of 220MHz. Ideal for industrial applications requiring precise timing control in compact designs.

Median Price

$8.610

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,930 parts In-Stock

1+ parts

$8.133

100+ parts

$6.630

1k+ parts

$4.420

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13,930

$8.133

$6.630

$4.420

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Mouser Electronics

USA . 269 parts In-Stock

1+ parts

$14.900

100+ parts

$10.850

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$7.930

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269

$14.900

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$7.930

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Rochester

USA . 503 parts In-Stock

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-

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$7.270

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$6.500

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$6.120

503

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$7.270

$6.500

$6.120

DigiKey

USA . 503 parts In-Stock

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$9.560

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$9.560

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Verical

USA . 400 parts In-Stock

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$9.088

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$8.125

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$7.650

400

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$9.088

$8.125

$7.650

Avnet

USA . 27 parts In-Stock

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$7.961

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$7.145

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27

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$7.961

$7.145

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Distributors (In-Stock)

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Digiode

USA . 142 parts In-Stock

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$6.660

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142

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Vyrian

USA . 2,883 parts In-Stock

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DigiKey Marketplace

USA . 518 parts In-Stock

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518

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Bristol Electronics

USA . 82 parts In-Stock

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Atlantic Semiconductor

USA . 55 parts In-Stock

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Inventory MP

USA . 50 parts In-Stock

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Semtec, LLC

USA . 40 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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40

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Elcom Components

USA . 31 parts In-Stock

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Prism Electronics

USA . 20 parts In-Stock

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Microfarads

USA . 17 parts In-Stock

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PC Components Company LLC

USA . 7 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 320 parts In-Stock

1+ parts

$1.520

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320

$1.520

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Northwest PG Solutions

USA . 1,723 parts In-Stock

1+ parts

$1.672

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1,723

$1.672

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Corphita

USA . 3,817 parts In-Stock

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$6.309

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3,817

$6.309

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Parana Technologies

USA . 460 parts In-Stock

1+ parts

$12.610

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$13.066

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460

$12.610

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$13.066

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DigiPath Technology Company

USA . 1,213 parts In-Stock

1+ parts

$13.886

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$12.775

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$13.886

$12.775

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

1+ parts

$14.169

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$13.461

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$12.752

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2,343

$14.169

$13.461

$12.752

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ChromeModa Solutions

Germany . 1,281 parts In-Stock

1+ parts

$14.169

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$11.619

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$14.169

$11.619

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A-Z Elektronik GmbH

Germany . 5,760 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,840 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$20.680

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$19.150

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$19.150

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$19.150

$19.150

Perfect Parts

USA . 821 parts In-Stock

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Kepictronics

USA . 77 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 40 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CDCVF857DGG clock driver and buffer from Texas Instruments. Crafted with precision and expertise, this high-quality product offers unmatched reliability and performance. Ideal for various applications in the clock drivers & buffers category, this innovative device ensures seamless operation and precise timing. Elevate your projects with the value and benefits that Texas Instruments brings to the table, providing customers with a cutting-edge solution that delivers exceptional results. Trust in Texas Instruments to bring your designs to life with the CDCVF857DGG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Input Conditioning: DIFFERENTIAL

Differential input conditioning ensures high signal integrity and noise immunity.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures consistent performance of the clock drivers and buffers.

Propagation Delay (tpd): 3.5 ns

Low propagation delay ensures fast signal processing and accurate timing.

Output Characteristics: 3-STATE

3-state output allows for tri-state control for flexible signal routing.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Minimum fmax: 220 MHz

High maximum frequency ensures compatibility with high-speed clock applications.

Technical Specifications

Clock Drivers & Buffers CDCVF857DGG attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

857

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.04 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Minimum fmax:

220 MHz

Trade Compliance

CDCVF857DGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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