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CDC7005RGZ

Texas Instruments

CDC7005RGZ by Texas Instruments

CDC7005RGZ clock driver by Texas Instruments features a 48-terminal chip carrier package with a propagation delay of 0.95 ns. It operates in industrial temperature grades from -40 to 85 °C, suitable for applications requiring differential input conditioning and 3-STATE output characteristics at frequencies up to 800 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,628 parts In-Stock

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5,628

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Digiode

USA . 927 parts In-Stock

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927

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Distributors (Availability)

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Native Components

USA . 256 parts In-Stock

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$1.680

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256

$1.680

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Northwest PG Solutions

USA . 1,229 parts In-Stock

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$1.848

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$1.848

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Andel Nordic

Denmark . 1,219 parts In-Stock

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$2.132

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$2.046

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$2.046

1,219

$2.132

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$2.046

$2.046

AZTECH Wire

Italy . 369 parts In-Stock

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$8.947

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369

$8.947

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$18.784

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$17.093

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$15.403

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$18.784

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Parana Technologies

USA . 302 parts In-Stock

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$22.494

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$23.161

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302

$22.494

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DigiPath Technology Company

USA . 1,054 parts In-Stock

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$24.769

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$22.787

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1,054

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ChromeModa Solutions

Germany . 5,476 parts In-Stock

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$25.274

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$20.725

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$25.274

$20.725

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IDEA Electronic Components Group

UK . 1,353 parts In-Stock

1+ parts

$25.274

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$24.010

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$22.747

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1,353

$25.274

$24.010

$22.747

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Corohmni

South Africa . 552 parts In-Stock

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$33.447

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552

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One Stop Electronics

USA . 322 parts In-Stock

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$54.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,526 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CDC7005RGZ by Texas Instruments, a top-quality clock driver & buffer that guarantees precision and reliability. With its innovative design and advanced technology, this product ensures seamless operation and optimal signal integrity for a wide range of applications. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that the CDC7005RGZ brings to your projects. Upgrade your systems today and unlock a new level of efficiency and functionality with this superior component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Enhances noise rejection and improves signal integrity in high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages in electronic devices, making it versatile for various applications.

Propagation Delay (tpd): 0.95 ns

Provides fast signal processing speeds, essential for high-performance clocking requirements.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges, ensuring reliable operation.

Output Characteristics: 3-STATE

Allows the output to be in three states (high, low, and high-impedance), providing flexibility in controlling signal flow.

No. of True Outputs: 5

Offers multiple outputs for driving clocks or signals to different components, increasing functionality.

Minimum fmax: 800 MHz

Capable of handling high-frequency signals, suitable for demanding applications such as data communication or digital processing.

Maximum Supply Voltage (Vsup): 3.6 V

Provides a safe operating voltage range, preventing damage from over-voltage conditions.

Technical Specifications

Clock Drivers & Buffers CDC7005RGZ attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

INTEGRATED LOW-NOISE OP AMP

Family:

7005

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDC7005RGZ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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