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CDC7005RGZRG4

Texas Instruments

CDC7005RGZRG4 by Texas Instruments

CDC7005RGZRG4 clock driver by Texas Instruments features 48 terminals, 3.3V nominal voltage, and 0.95ns propagation delay. Ideal for industrial applications requiring differential input conditioning and 800MHz min fmax with a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,552 parts In-Stock

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Electronics Depot

USA . 2,443 parts In-Stock

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Digiode

USA . 1,232 parts In-Stock

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Andel Nordic

Denmark . 3,606 parts In-Stock

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$6.618

100+ parts

-

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$6.353

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$6.353

3,606

$6.618

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$6.353

$6.353

AZTECH Wire

Italy . 198 parts In-Stock

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$13.845

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One Stop Electronics

USA . 263 parts In-Stock

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$21.000

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Parana Technologies

USA . 2,104 parts In-Stock

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$29.952

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$65.165

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$29.952

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DigiPath Technology Company

USA . 1,108 parts In-Stock

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$32.981

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IDEA Electronic Components Group

UK . 1,678 parts In-Stock

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$33.654

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$31.971

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$30.289

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ChromeModa Solutions

Germany . 434 parts In-Stock

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$33.654

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$27.596

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434

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Northwest PG Solutions

USA . 1,991 parts In-Stock

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Corphita

USA . 1,710 parts In-Stock

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Native Components

USA . 980 parts In-Stock

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Microchip USA

USA . 324 parts In-Stock

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Overview

Experience exceptional performance and reliability with the CDC7005RGZRG4 clock driver by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that meet the needs of various applications. The CDC7005RGZRG4 is designed to provide precise timing solutions, ensuring optimal performance in your projects. With advanced features and superior craftsmanship, this clock driver offers unmatched value and benefits to customers looking for a dependable solution. Trust Texas Instruments to deliver excellence with the CDC7005RGZRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Enables reliable data transmission by reducing noise and interference, ensuring accurate clock signals.

Nominal Supply Voltage (Vsup): 3.3V

Operates at a standard voltage level, making it compatible with a wide range of systems.

Propagation Delay (tpd): 0.95 ns

Provides fast signal processing and synchronization, optimizing performance in high-speed applications.

Minimum Operating Temperature: -40°C

Functions reliably in harsh environmental conditions, ensuring consistent operation in various temperature settings.

Maximum Same Edge Skew (tskwd): 0.06 ns

Maintains signal integrity and accuracy by minimizing skew, enhancing overall system performance.

Minimum fmax: 800 MHz

Supports high-frequency operation, making it suitable for demanding applications that require fast data processing.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring reliability and longevity in humid environments.

Technical Specifications

Clock Drivers & Buffers CDC7005RGZRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

INTEGRATED LOW-NOISE OP AMP

Family:

7005

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDC7005RGZRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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