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CDC7005RGZTG4

Texas Instruments

CDC7005RGZTG4 by Texas Instruments

CDC7005RGZTG4 clock driver by Texas Instruments features 48 terminals, 3.3V supply voltage, and 0.95ns propagation delay. Ideal for industrial applications requiring differential input conditioning and 800MHz min fmax with a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,064 parts In-Stock

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Digiode

USA . 630 parts In-Stock

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630

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Distributors (Availability)

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Andel Nordic

Denmark . 1,476 parts In-Stock

1+ parts

$2.245

100+ parts

-

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$2.155

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$2.155

1,476

$2.245

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$2.155

$2.155

Northwest PG Solutions

USA . 915 parts In-Stock

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$2.580

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915

$2.580

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Parana Technologies

USA . 1,460 parts In-Stock

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$16.571

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$16.846

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$16.571

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$16.846

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DigiPath Technology Company

USA . 1,236 parts In-Stock

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$18.247

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$16.787

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$18.247

$16.787

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ChromeModa Solutions

Germany . 3,310 parts In-Stock

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$18.619

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$15.268

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$18.619

$15.268

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IDEA Electronic Components Group

UK . 111 parts In-Stock

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$18.619

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$17.688

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$16.757

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111

$18.619

$17.688

$16.757

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AZTECH Wire

Italy . 312 parts In-Stock

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$19.845

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One Stop Electronics

USA . 1,118 parts In-Stock

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$32.000

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Ampacity Inc.

Singapore . 1,608 parts In-Stock

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$59.000

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$59.000

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Native Components

USA . 310 parts In-Stock

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$2.275

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Corphita

USA . 55 parts In-Stock

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Overview

Unleash the power of precision clock synchronization with the CDC7005RGZTG4 by Texas Instruments. Crafted with the highest quality materials and expertise, this clock driver offers unparalleled performance in a variety of applications. With its innovative design and reliability, customers can trust in the seamless operation and enhanced functionality that this product brings to their projects. Elevate your designs with the CDC7005RGZTG4 and experience the value it delivers in every aspect of your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving space and simplifying assembly processes.

Input Conditioning: DIFFERENTIAL

The differential input conditioning helps in reducing noise and improving signal integrity, making the product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of applications and power sources.

No. of Terminals: 48

With a high number of terminals, this product offers versatile connectivity options and can support complex circuit configurations.

Propagation Delay (tpd): 0.95 ns

The low propagation delay of 0.95ns ensures fast signal transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to function reliably in demanding environmental conditions.

Output Characteristics: 3-STATE

Featuring 3-state output characteristics provides flexibility in controlling the output signal, allowing for efficient power management and signal routing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in a wide range of temperature conditions, making it versatile and reliable.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent conductivity and corrosion resistance, ensuring reliable electrical connections for the product.

Technical Specifications

Clock Drivers & Buffers CDC7005RGZTG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

INTEGRATED LOW-NOISE OP AMP

Family:

7005

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDC7005RGZTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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