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CDC7005RGZR

Texas Instruments

CDC7005RGZR by Texas Instruments

CDC7005RGZR clock driver by Texas Instruments features a propagation delay of 0.95 ns, 3-STATE output characteristics, and operates in an industrial temperature range from -40 to 85°C. With a package style of CHIP CARRIER and very thin profile, it is suitable for applications requiring differential input conditioning and a supply voltage range of 3V to 3.6V.

Median Price

$11.048

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34,772 parts In-Stock

1+ parts

-

100+ parts

$9.820

1k+ parts

$8.790

10k+ parts

$8.270

34,772

-

$9.820

$8.790

$8.270

Verical

USA . 14,853 parts In-Stock

1+ parts

-

100+ parts

$12.275

1k+ parts

$10.988

10k+ parts

$10.338

14,853

-

$12.275

$10.988

$10.338

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 516 parts In-Stock

1+ parts

$10.364

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$10.364

-

-

-

Bristol Electronics

USA . 1,784 parts In-Stock

1+ parts

$12.375

100+ parts

$7.425

1k+ parts

$7.116

10k+ parts

-

1,784

$12.375

$7.425

$7.116

-

DigiKey Marketplace

USA . 34,804 parts In-Stock

1+ parts

-

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-

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34,804

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-

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Vyrian

USA . 2,611 parts In-Stock

1+ parts

-

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-

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2,611

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 909 parts In-Stock

1+ parts

$0.706

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$0.706

-

-

-

Northwest PG Solutions

USA . 1,164 parts In-Stock

1+ parts

$0.777

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$0.777

-

-

-

Andel Nordic

Denmark . 3,069 parts In-Stock

1+ parts

$4.619

100+ parts

-

1k+ parts

$4.434

10k+ parts

$4.434

3,069

$4.619

-

$4.434

$4.434

Corphita

USA . 3,604 parts In-Stock

1+ parts

$9.819

100+ parts

-

1k+ parts

-

10k+ parts

-

3,604

$9.819

-

-

-

Parana Technologies

USA . 1,746 parts In-Stock

1+ parts

$15.134

100+ parts

-

1k+ parts

$15.539

10k+ parts

-

1,746

$15.134

-

$15.539

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$16.664

100+ parts

$15.331

1k+ parts

-

10k+ parts

-

1,885

$16.664

$15.331

-

-

ChromeModa Solutions

Germany . 6,847 parts In-Stock

1+ parts

$17.004

100+ parts

$13.943

1k+ parts

-

10k+ parts

-

6,847

$17.004

$13.943

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IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$17.004

100+ parts

$16.154

1k+ parts

$15.304

10k+ parts

-

1,547

$17.004

$16.154

$15.304

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A-Z Elektronik GmbH

Germany . 5,649 parts In-Stock

1+ parts

-

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5,649

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Alle Elektronik GmbH

Germany . 3,766 parts In-Stock

1+ parts

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3,766

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Kepictronics

USA . 1,746 parts In-Stock

1+ parts

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1,746

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Microchip USA

USA . 311 parts In-Stock

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311

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Overview

Elevate your electronic designs with the CDC7005RGZR clock driver & buffer from Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance in a wide range of applications. With its advanced features and reliable design, customers can trust in the value and benefits that this component brings to their projects. Experience enhanced efficiency and functionality with the CDC7005RGZR, setting new standards in clock drivers & buffers. Elevate your designs today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Facilitates easy installation and soldering onto circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Ensures stable and accurate signal transmission, particularly in high-speed applications where noise immunity is essential.

Nominal Supply Voltage / Vsup (V): 3.3

Matches common supply voltages in electronic systems, making it compatible with a wide range of applications.

Propagation Delay (tpd): 0.95 ns

Provides fast signal processing, contributing to the overall efficiency and performance of the clock driver.

Maximum Operating Temperature: 85 °C

Allows the clock driver to withstand higher temperature environments, making it suitable for industrial applications.

No. of True Outputs: 5

Offers multiple output options, increasing flexibility for connecting to various components in the system.

Minimum fmax: 800 MHz

Supports high-frequency operations, making it ideal for demanding applications that require fast data processing.

Technical Specifications

Clock Drivers & Buffers CDC7005RGZR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

INTEGRATED LOW-NOISE OP AMP

Family:

7005

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.95 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.06 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

800 MHz

Trade Compliance

CDC7005RGZR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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