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CDC337DWG4

Texas Instruments

CDC337DWG4 by Texas Instruments

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,572 parts In-Stock

1+ parts

-

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3,572

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Digiode

USA . 2,530 parts In-Stock

1+ parts

-

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2,530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,690 parts In-Stock

1+ parts

$5.629

100+ parts

-

1k+ parts

$5.404

10k+ parts

$5.404

2,690

$5.629

-

$5.404

$5.404

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$11.537

100+ parts

$10.499

1k+ parts

$9.460

10k+ parts

-

600

$11.537

$10.499

$9.460

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$13.758

100+ parts

-

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306

$13.758

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Corohmni

South Africa . 387 parts In-Stock

1+ parts

$19.826

100+ parts

-

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387

$19.826

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Parana Technologies

USA . 1,092 parts In-Stock

1+ parts

$28.772

100+ parts

-

1k+ parts

$51.691

10k+ parts

-

1,092

$28.772

-

$51.691

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DigiPath Technology Company

USA . 2,189 parts In-Stock

1+ parts

$31.681

100+ parts

$29.147

1k+ parts

-

10k+ parts

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2,189

$31.681

$29.147

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ChromeModa Solutions

Germany . 5,622 parts In-Stock

1+ parts

$32.328

100+ parts

$26.509

1k+ parts

-

10k+ parts

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5,622

$32.328

$26.509

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IDEA Electronic Components Group

UK . 800 parts In-Stock

1+ parts

$32.328

100+ parts

$30.712

1k+ parts

$29.095

10k+ parts

-

800

$32.328

$30.712

$29.095

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One Stop Electronics

USA . 367 parts In-Stock

1+ parts

$36.000

100+ parts

-

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367

$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 2,361 parts In-Stock

1+ parts

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2,361

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Corphita

USA . 1,913 parts In-Stock

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1,913

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Northwest PG Solutions

USA . 1,800 parts In-Stock

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1,800

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Microchip USA

USA . 1,330 parts In-Stock

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1,330

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Native Components

USA . 96 parts In-Stock

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96

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Technical Specifications

Clock Drivers & Buffers CDC337DWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

337

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.825 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

.9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.9 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.52 mm

Minimum fmax:

80 MHz

Trade Compliance

CDC337DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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